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Fundamentals of Electromigration-Aware Integrated Circuit Design - Jens Lienig, Matthias Thiele

Fundamentals of Electromigration-Aware Integrated Circuit Design

Buch | Hardcover
XIII, 159 Seiten
2018 | 1st ed. 2018
Springer International Publishing (Verlag)
978-3-319-73557-3 (ISBN)
CHF 179,70 inkl. MwSt
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The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration's negative impact on circuit reliability.

Jens Lienig is the director of the Institute of Electromechanical and Electronic Design at Dresden University of Technology, Germany. He received his Ph.D. in the field of computer-aided physical design of multi-chip modules and was employed as a researcher at University of Virginia, Charlottesville and Concordia University, Montreal. Afterwards he worked as project manager at Tanner Research, Inc. and Robert Bosch GmbH. His main research subjects are design of electronic systems and electronic design automation. He is a member of IEEE. Matthias Thiele is a scientific assistant at Dresden University of Technology, Germany. He received his Ph.D. in the field of electromigration. Currently he works on the reliability of electronic and mechatronic systems.

Introduction.- Fundamentals of Electromigration.- Integrated Circuit Design and Electromigration.- Mitigating Electromigration in Physical Design.- Summary and Outlook.

Erscheinungsdatum
Zusatzinfo XIII, 159 p. 99 illus., 95 illus. in color.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Gewicht 432 g
Themenwelt Mathematik / Informatik Informatik Theorie / Studium
Technik Elektrotechnik / Energietechnik
Schlagworte Blech length • Circuit Design • Current density • electromigration • Interconnect Reliability • physical design • reservoir effect • short-length effects • short-line rules • VLSI Design
ISBN-10 3-319-73557-8 / 3319735578
ISBN-13 978-3-319-73557-3 / 9783319735573
Zustand Neuware
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