Fundamentals of Electromigration-Aware Integrated Circuit Design

Jens Lienig, Matthias Thiele (Autoren)

Buch | Softcover

XIII, 159 Seiten

2018 | Softcover reprint of the original 1st ed. 2018
Springer International Publishing (Verlag)
978-3-030-08811-8 (ISBN)

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The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. It introduces the physical process of electromigration, which gives the reader the requisite understanding and knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration's negative impact on circuit reliability.

Jens Lienig is the director of the Institute of Electromechanical and Electronic Design at Dresden University of Technology, Germany. He received his Ph.D. in the field of computer-aided physical design of multi-chip modules and was employed as a researcher at University of Virginia, Charlottesville and Concordia University, Montreal. Afterwards he worked as project manager at Tanner Research, Inc. and Robert Bosch GmbH. His main research subjects are design of electronic systems and electronic design automation. He is a member of IEEE. Matthias Thiele is a scientific assistant at Dresden University of Technology, Germany. He received his Ph.D. in the field of electromigration. Currently he works on the reliability of electronic and mechatronic systems.

Introduction.- Fundamentals of Electromigration.- Integrated Circuit Design and Electromigration.- Mitigating Electromigration in Physical Design.- Summary and Outlook.

Erscheinungsdatum	05.03.2022
Zusatzinfo	XIII, 159 p. 99 illus., 95 illus. in color.
Verlagsort	Cham
Sprache	englisch
Maße	155 x 235 mm
Gewicht	279 g
Themenwelt	Mathematik / Informatik ► Informatik ► Theorie / Studium
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Schlagworte	Blech length • Circuit Design • Current density • electromigration • Interconnect Reliability • physical design • reservoir effect • short-length effects • short-line rules • VLSI Design
ISBN-10	3-030-08811-1 / 3030088111
ISBN-13	978-3-030-08811-8 / 9783030088118
Zustand	Neuware