Fundamentals of Electromigration-Aware Integrated Circuit Design
Springer International Publishing (Verlag)
978-3-031-80022-1 (ISBN)
- Noch nicht erschienen - erscheint am 04.03.2025
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The book provides a comprehensive overview of electromigration and its effects on the reliability of electronic circuits. This second edition has been updated to introduce recent advancements in the understanding of the physical process of electromigration, which gives the reader the knowledge for adopting appropriate counter measures. A comprehensive set of options is presented for modifying the present IC design methodology to prevent electromigration. Finally, the authors show how specific effects can be exploited in present and future technologies to reduce electromigration's negative impact on circuit reliability.
Jens Lienig is the director of the Institute of Electromechanical and Electronic Design at Dresden University of Technology, Germany. He received his Ph.D. in the field of computer-aided physical design of multi-chip modules and was employed as a researcher at University of Virginia, Charlottesville and Concordia University, Montreal. Afterwards he worked as project manager at Tanner Research, Inc. and Robert Bosch GmbH.
Susann Rothe is a scientific assistant at Dresden University of Technology, Germany. She is working towards her Ph.D. in the field of migration modeling and verification with physics-based models. Her research interests include technology characterization and temperature effects for interconnect reliability.
Matthias Thiele is a scientific assistant at Dresden University of Technology, Germany. He received his Ph.D. in the field of electromigration avoidance in physical design. Currently he works on the reliability of electronic, mechatronic and photonic systems.
Introduction.- Fundamentals of Electromigration.- Integrated Circuit Design and Electromigration.- Mitigating Electromigration in Physical Design.- Summary and Outlook.
| Erscheint lt. Verlag | 4.3.2025 |
|---|---|
| Zusatzinfo | XII, 164 p. 97 illus., 94 illus. in color. |
| Verlagsort | Cham |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Mathematik / Informatik ► Informatik ► Theorie / Studium |
| Technik ► Elektrotechnik / Energietechnik | |
| Schlagworte | Blech length • Circuit Design • Current density • electromigration • Interconnect Reliability • physical design • reservoir effect • short-length effects • short-line rules • VLSI Design |
| ISBN-10 | 3-031-80022-2 / 3031800222 |
| ISBN-13 | 978-3-031-80022-1 / 9783031800221 |
| Zustand | Neuware |
| Informationen gemäß Produktsicherheitsverordnung (GPSR) | |
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