Thermal Reliability of Power Semiconductor Device in the Renewable Energy System (eBook)

Xiong Du, Jun Zhang, Gaoxian Li, Yaoyi Yu, Cheng Qian, Rui Du (Autoren)

eBook Download: PDF

2022 | 1st ed. 2022
XVI, 172 Seiten
Springer Nature Singapore (Verlag)
978-981-19-3132-1 (ISBN)

Infos

This book focuses on the thermal reliability of power semiconductor device by looking at the failure mechanism, thermal parameters monitoring, junction temperature estimation, lifetime evaluation, and thermal management. Theoretical analysis and experimental tests are presented to explain existing reliability improvement techniques. This book is a valuable reference for the students and researchers who pay attention to the thermal reliability design of power semiconductor device. 

Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008.

Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.

Produkt-Details

• Erscheint lt. Verlag: 8.7.2022
• Reihe/Serie: CPSS Power Electronics Series
• Reihe/Serie: CPSS Power Electronics Series
• Zusatzinfo: XVI, 172 p. 121 illus., 94 illus. in color.
• Sprache: englisch
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• Schlagworte: failure mechanism • Junction temperature estimation • Lifetime evaluation • thermal management • Thermal parameters monitoring • thermal reliability
• ISBN-10: 981-19-3132-1 / 9811931321
• ISBN-13: 978-981-19-3132-1 / 9789811931321