Thermal Reliability of Power Semiconductor Device in the Renewable Energy System
Springer Verlag, Singapore
978-981-19-3131-4 (ISBN)
Xiong Du obtained his B.S., M.S., and Ph. D. degrees from Chongqing University, China in 2000, 2002, and 2005 respectively, all in the Electrical Engineering. He has been with Chongqing University since 2002 and is currently a full professor in the School of Electrical Engineering, Chongqing University. He was a visiting scholar at Rensselaer Polytechnic Institute, Troy, NY from July 2007 to July 2008. His research interests include power electronics system reliability and stability. He is a recipient of the National Excellent Doctoral Dissertation of P.R. China in 2008. Jun Zhang obtained his B.S. degree from Anhui University, China, in 2014 and Ph. D. degree from Chongqing University, China, in 2019, all in the Electrical Engineering. He is currently working as a lecture in the College of Energy and Electrical Engineering, Hohai University, Nanjing, China. His research interests include the reliability of power electronics system.
Introduction.- Thermal fatigue failure mechanism of power devices in renewable energy system.- Thermal model and thermal parameters monitoring.- Thermal analysis of power semiconductor device in renewable energy system.- Multi-time scale lifetime evaluation for the device in the renewable application.- Thermal management design and optimization.- Prospect.
Erscheinungsdatum | 13.07.2022 |
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Reihe/Serie | CPSS Power Electronics Series |
Zusatzinfo | 94 Illustrations, color; 27 Illustrations, black and white; XVI, 172 p. 121 illus., 94 illus. in color. |
Verlagsort | Singapore |
Sprache | englisch |
Maße | 155 x 235 mm |
Themenwelt | Technik ► Elektrotechnik / Energietechnik |
ISBN-10 | 981-19-3131-3 / 9811931313 |
ISBN-13 | 978-981-19-3131-4 / 9789811931314 |
Zustand | Neuware |
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