Electronic Materials and Processes Handbook
McGraw-Hill Professional (Verlag)
978-0-07-140214-9 (ISBN)
- Titel ist leider vergriffen;
keine Neuauflage - Artikel merken
Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.
Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.
Chapter 1: Development and Fabrication of IC ChipsChapter 2: Plastics, Elastomers, and CompositesChapter 3: Ceramics and GlassesChapter 4: MetalsChapter 5: Solder Technologies for Electronic Packaging and AssemblyChapter 6: Electroplating and Deposited Metallic CoatingsChapter 7: Printed Circuit Board FabricationChapter 8: Materials and Processes for Hybrid Microelectronics and Multichip ModulesChapter 9: Adhestives Underfills, and Coatings in Electronics AssembliesChapter 10: Thermal Management Materials and Systems Index
| Erscheint lt. Verlag | 16.9.2003 |
|---|---|
| Zusatzinfo | 400 illustrations |
| Sprache | englisch |
| Maße | 198 x 241 mm |
| Gewicht | 1429 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 0-07-140214-4 / 0071402144 |
| ISBN-13 | 978-0-07-140214-9 / 9780071402149 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
aus dem Bereich
