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Electronic Materials and Processes Handbook

Buch | Hardcover
816 Seiten
1993 | 2nd edition
McGraw-Hill Professional (Verlag)
978-0-07-054299-0 (ISBN)
CHF 163,95 inkl. MwSt
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Provides electronic engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. This edition features more than 70per cent new or revised material.
Today, the successful design and manufacture of electronic devices requires expertise in both materials science and manufacturing processes. This reference provides electronics engineers and materials scientists with the information they need on the materials and processes currently used to fabricate, interconnect and package electronic components and systems. Featuring more than 70 percent new or revised material, the second edition of this reference contains information on plastics, elastomers, and laminates; printed wiring boards; ceramics and glasses semiconductors; ferrous and nonferrous metals; wire and cable; metal joining of electronic circuits; thick and thin films; electrodeposition materials and processes; lithography and photofabrication; and materials and processes for advanced packaging.

Charles A. Harper is president of Technology Seminars, Inc., an organization devoted to presenting seminars on electronic packaging and related subjects to the electronics industry. He is a graduate of The John Hopkins University School of Engineering , Baltimore, MD., and a past member of the engineering faculty of The Johns Hopkins University. He is active in numerous professional societies, including the International Microelectronics and Packaging Society (of which he is a past president), the National Electronic Packaging Conference (NEPCON), and the Institute of Electrical and Electronics Engineers. He is series editor of McGraw-Hill's Electronic Packaging and Interconnection Technology Series and a member of the Editorial Advisory Board of Electronic Packaging and Production magazine.

Plastics, Elastomers, and Processing.Printed Wiring Boards.Ceramics and Glasses.Semiconductors, Ferrous and Non-Ferrous Metals.Wire and Cable.Metal Joining of Electronic Circuits.Thick and Thin Films.Electrodeposition Materials and Processes.Lithography and Photofabrication.Materials and Processes for Advanced Packaging.

Erscheint lt. Verlag 31.12.1993
Zusatzinfo 650 illustrations
Sprache englisch
Maße 160 x 236 mm
Gewicht 1100 g
Themenwelt Schulbuch / Wörterbuch Lexikon / Chroniken
Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 0-07-054299-6 / 0070542996
ISBN-13 978-0-07-054299-0 / 9780070542990
Zustand Neuware
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