Self-Organized 3D Integrated Optical Interconnects (eBook)

with All-Photolithographic Heterogeneous Integration

Tetsuzo Yoshimura (Autor)

eBook Download: PDF

2021
380 Seiten
Jenny Stanford Publishing (Verlag)
978-1-000-06460-5 (ISBN)

Infos

Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve "e;short line distances of the cm-mm order"e; and "e;large line counts of hundreds-thousands."e; This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules. This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.

Produkt-Details

• Erscheint lt. Verlag: 9.3.2021
• Sprache: englisch
• Themenwelt: Naturwissenschaften ► Physik / Astronomie ► Elektrodynamik
• Themenwelt: Naturwissenschaften ► Physik / Astronomie ► Optik
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Umwelttechnik / Biotechnologie
• ISBN-10: 1-000-06460-3 / 1000064603
• ISBN-13: 978-1-000-06460-5 / 9781000064605