Self-Organized 3D Integrated Optical Interconnects
Jenny Stanford Publishing (Verlag)
978-981-4877-04-6 (ISBN)
Currently, light waves are ready to come into boxes of computers in high-performance computing systems like data centers and super computers to realize intra-box optical interconnects. For inter-box optical interconnects, light waves have successfully been introduced by OE modules, in which discrete bulk-chip OE/electronic devices are assembled using the flip-chip-bonding-based packaging technology. OE modules, however, are not applicable to intra-box optical interconnects, because intra-box interconnects involve “short line distances of the cm–mm order” and “large line counts of hundreds-thousands.” This causes optics excess, namely, excess components, materials, spaces, fabrication efforts for packaging, and design efforts. The optics excess raises sizes and costs of intra-box optical interconnects enormously when they are built using conventional OE modules.
This book proposes the concept of self-organized 3D integrated optical interconnects and the strategy to reduce optics excess in intra-box optical interconnects.
Tetsuzo Yoshimura is currently a professor emeritus at Tokyo University of Technology.
1. Introduction 2. Guidelines toward Self-Organized 3D Integrated Optical Interconnects 3. Scalable Film Optical Link Modules (S-FOLMs) 4. Optical Waveguide Films with Vertical Mirrors and 3D Optical Circuits 5. Resource Saving All-Photolithographic Heterogeneous Integration: PL-Pack with SORT 6. High-Speed/Small-Size Light Modulators and Optical Switches 7. Self-Organized Lightwave Networks (SOLNETs) 8. Self-Organized 3D Integrated Optical Interconnects: Model Proposals 9. Self-Organized 3D Micro Optical Switching Systems (3D-MOSS): Model Proposals and Predicted Performance 10. Film-Based Integrated Solar Energy Conversion Systems 11. Embodiments Disclosed in Patents 12. Future Challenges
| Erscheinungsdatum | 01.09.2020 |
|---|---|
| Zusatzinfo | 13 Tables, black and white; 28 Illustrations, color; 244 Illustrations, black and white |
| Sprache | englisch |
| Maße | 152 x 229 mm |
| Gewicht | 839 g |
| Themenwelt | Naturwissenschaften ► Physik / Astronomie ► Optik |
| Technik ► Elektrotechnik / Energietechnik | |
| Technik ► Umwelttechnik / Biotechnologie | |
| ISBN-10 | 981-4877-04-2 / 9814877042 |
| ISBN-13 | 978-981-4877-04-6 / 9789814877046 |
| Zustand | Neuware |
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