Ultra-thin Chip Technology and Applications

Buch | Softcover

467 Seiten

2016 | Softcover reprint of the original 1st ed. 2011
Springer-Verlag New York Inc.
978-1-4939-5118-5 (ISBN)

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Ultra-thin chips are the "smart skin" of a conventional silicon chip. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.

Fabrication technologies for ultra-thin chips.- Post-processing techniques and issues.- Properties of ultra-thin chips; Applications.

Erscheint lt. Verlag	23.8.2016
Zusatzinfo	XXII, 467 p.
Verlagsort	New York
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Informatik ► Weitere Themen ► CAD-Programme
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Schlagworte	3D Integrated Circuits • ChipFilm • Circuit Design • Embedded Systems • microelectronics • microsystems • nanomaterials • nanotechnology • System in Foil • Ultra-thin Chips
ISBN-10	1-4939-5118-1 / 1493951181
ISBN-13	978-1-4939-5118-5 / 9781493951185
Zustand	Neuware