Ultra-thin Chip Technology and Applications
Seiten
2010
Springer-Verlag New York Inc.
978-1-4419-7275-0 (ISBN)
Springer-Verlag New York Inc.
978-1-4419-7275-0 (ISBN)
Ultra-thin chips are the "smart skin" of a conventional silicon chip. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Ultra-thin chips are the "smart skin" of a conventional silicon chip. This book shows how very thin and flexible chips can be fabricated and used in many new applications in microelectronics, Microsystems, biomedical and other fields. It provides a comprehensive reference to the fabrication technology, post processing, characterization and the applications of ultra-thin chips.
Fabrication technologies for ultra-thin chips.- Post-processing techniques and issues.- Properties of ultra-thin chips; Applications.
| Zusatzinfo | XXII, 467 p. |
|---|---|
| Verlagsort | New York, NY |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Themenwelt | Informatik ► Weitere Themen ► CAD-Programme |
| Technik ► Elektrotechnik / Energietechnik | |
| ISBN-10 | 1-4419-7275-7 / 1441972757 |
| ISBN-13 | 978-1-4419-7275-0 / 9781441972750 |
| Zustand | Neuware |
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