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Hardware

Solve common C++ problems with modern design patterns and build robust applications
von Fedor G. Pikus
Buch | Softcover
2023 | Packt Publishing Limited
ISBN: 9781804611555
CHF 64,55 (inkl. MwSt)
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A Comprehensive Beginner's Guide to Setup, Programming (Concepts and Techniques) and Developing Cool Raspberry Pi Projects
von Joe Grant
Buch | Softcover
2023 | IngramSpark
ISBN: 9781088224915
CHF 27,90 (inkl. MwSt)
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5th EAI International Conference, AFRICATEK 2022, Bloemfontein, South Africa, December 5-7, 2022, Proceedings
von Muthoni Masinde; Antoine Bagula
Buch | Softcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031358821
CHF 104,80 (inkl. MwSt)
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Diodes, Transistors, Solar Cells, Charge Coupled Devices and Solid State Lasers
von Amal Banerjee
Buch | Hardcover
2023 | Springer International Publishing
ISBN: 9783031457494
CHF 74,85 (inkl. MwSt)
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29th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2021, Singapore, October 4–8, 2021, Revised and Extended..
von Victor Grimblatt; Chip Hong Chang; Ricardo Reis;..
Buch | Softcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031168208
CHF 74,85 (inkl. MwSt)
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Proceedings of the International Conference on Emerging Trends in IoT and Computing Technologies (ICEICT-2022), April 22-23, 2022, Lucknow, India
von Suman Lata Tripathi; Devendra Agarwal; Satya..
Buch | Softcover
2023 | Routledge
ISBN: 9781032485249
CHF 64,55 (inkl. MwSt)
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IoT Technologies, Big Data Solutions, Cloud Platforms, and Cybersecurity Techniques
von Alex Khang; Shashi Kant Gupta; Sita Rani;..
Buch | Hardcover
2023 | CRC Press
ISBN: 9781032451114
CHF 199,95 (inkl. MwSt)
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3rd International Conference, SmartTech-IC 2022, Cuenca, Ecuador, November 16–18, 2022, Revised Selected Papers
von Fabián R. Narváez; Fernando Urgilés; Teodiano..
Buch | Softcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031322129
CHF 149,75 (inkl. MwSt)
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5th CCF China Blockchain Conference, CBCC 2022, Wuxi, China, December 23–25, 2022, Proceedings
von Yi Sun; Liang Cai; Wei Wang; Xianhua Song;..
Buch | Softcover
2022 | Springer Verlag, Singapore
ISBN: 9789811988769
CHF 97,35 (inkl. MwSt)
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