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14th IFIP WG 5.5/SOCOLNET Doctoral Conference on Computing, Electrical and Industrial Systems, DoCEIS 2023, Caparica, Portugal, July 5–7, 2023,..
von Luis M. Camarinha-Matos; Filipa Ferrada
Buch | Hardcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031360060
CHF 149,75 (inkl. MwSt)
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von Kimia Zamiri Azar; Hadi Mardani Kamali; Farimah..
Buch | Hardcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031379888
CHF 149,75 (inkl. MwSt)
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IFIP WG 8.2 and WG 9.4 Joint Working Conference, IFIPJWC 2023, Hyderabad, India, December 7–8, 2023, Proceedings
von Matthew R. Jones; Arunima S. Mukherjee; Devinder..
Buch | Hardcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031501531
CHF 149,75 (inkl. MwSt)
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Use, manage and build secure and scalable databases with PostgreSQL 16
von Luca Ferrari; Enrico Pirozzi
Buch | Softcover
2023 | Packt Publishing Limited
ISBN: 9781837635641
CHF 59,30 (inkl. MwSt)
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12th International Conference, ICIG 2023, Nanjing, China, September 22–24, 2023, Proceedings, Part IV
von Huchuan Lu; Wanli Ouyang; Hui Huang; Jiwen Lu;..
Buch | Softcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031463136
CHF 109,95 (inkl. MwSt)
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12th International Conference, ICIG 2023, Nanjing, China, September 22–24, 2023, Proceedings, Part I
von Huchuan Lu; Wanli Ouyang; Hui Huang; Jiwen Lu;..
Buch | Softcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031463044
CHF 109,95 (inkl. MwSt)
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ISC High Performance 2023 International Workshops, Hamburg, Germany, May 21–25, 2023, Revised Selected Papers
von Amanda Bienz; Michèle Weiland; Marc Baboulin;..
Buch | Softcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031408427
CHF 134,80 (inkl. MwSt)
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Combine machine learning with microcontrollers to solve real-world problems
von Gian Marco Iodice
Buch | Softcover
2023 | Packt Publishing Limited
ISBN: 9781837637362
CHF 57,60 (inkl. MwSt)
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19th International Conference, Held as Part of the Services Conference Federation, SCF 2023, Honolulu, HI, USA, September 23–26, 2023, Proceedings
von Sheng He; Jiacai Lai; Liang-Jie Zhang
Buch | Softcover
2023 | Auflage: 1 | Springer International Publishing
ISBN: 9783031447532
CHF 74,85 (inkl. MwSt)
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