Understanding Fabless IC Technology
Newnes (an imprint of Butterworth-Heinemann Ltd ) (Verlag)
978-0-7506-7944-2 (ISBN)
Fabless (no fabrication) IC (integrated circuit) techniques are growing rapidly and promise to become the standard method of IC manufacturing in the near future, this book will provide readers with what will soon be required knowledge of the subject. Other books on IC fabrication deal with the strictly physical process aspects of the topic and assume all factors in IC fabrication are under the control of the IC designing company. By contrast, this title recognizing that fabless IC design is often as much about managing business relationships as it is about physical processes. “Fabless ICs are those designed and marketed by one company but actually manufactured by another.
PART 1 – Manufacturing Strategies: Understanding Fabless IC Technology
Chapter 1: More than a Decade of Transition in the Semiconductor Industry
Chapter 2: Fabless Semiconductor Manufacturing
Chapter 3: Qualities of Successful Fabless Companies
PART 2 – An In-Depth Understanding of the Fabless Semiconductor Business Model
Chapter 4: Semiconductor Manufacturing Basics
Chapter 5: Fabless ASICs
Chapter 6: Electronic Design Automation
Chapter 7: Intellectual Property
Chapter 8: e- Commerce
Chapter 9: Quality and Reliability
Chapter 10: Test Development
PART 3 – Becoming a Best-in-Class Fabless Company
Chapter 11: Best Practices for Fabless Companies
Chapter 12: Building the Right Partnerships
Chapter 13: Building the Right Relationships with the board and VCs
PART 4- The Fabless Business Model: A Look into the Future
Chapter 14: Perspectives in the Future of Fabless
| Erscheint lt. Verlag | 22.10.2007 |
|---|---|
| Zusatzinfo | Illustrated; Illustrations, unspecified |
| Verlagsort | Oxford |
| Sprache | englisch |
| Maße | 191 x 235 mm |
| Gewicht | 580 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 0-7506-7944-1 / 0750679441 |
| ISBN-13 | 978-0-7506-7944-2 / 9780750679442 |
| Zustand | Neuware |
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