Nicht aus der Schweiz? Besuchen Sie lehmanns.de
Yield Simulation for Integrated Circuits - D.M. Walker

Yield Simulation for Integrated Circuits

(Autor)

Buch | Hardcover
209 Seiten
1987
Kluwer Academic Publishers (Verlag)
978-0-89838-244-0 (ISBN)
CHF 224,65 inkl. MwSt
Since only half the chip area would have redundancy, I was concerned that the increase in yield would not outweigh the increased costs of testing and redundancy programming. I wanted a simulator that would allow me to evaluate the yield of arbitrary redundant layouts, hence I termed such a simulator a layout or yield simulator.
In the summer of 1981 I was asked to consider the possibility of manufacturing a 600,000 transistor microprocessor in 1985. It was clear that the technology would only be capable of manufacturing 100,000-200,000 transistor chips with acceptable yields. The control store ROM occupied approximately half of the chip area, so I considered adding spare rows and columns to increase ROM yield. Laser-programmed polysilicon fuses would be used to switch between good and bad circuits. Since only half the chip area would have redundancy, I was concerned that the increase in yield would not outweigh the increased costs of testing and redundancy programming. The fabrication technology did not yet exist, so I was unable to experimentally verify the benefits of redundancy. When the technology did become available, it would be too late in the development schedule to spend time running test chips. The yield analysis had to be done analytically or by simulation. Analytic yield analysis techniques did not offer sufficient accuracy for dealing with complex structures. The simulation techniques then available were very labor-intensive and seemed more suitable for redundant memories and other very regular structures [Stapper 80J. I wanted a simulator that would allow me to evaluate the yield of arbitrary redundant layouts, hence I termed such a simulator a layout or yield simulator. Since I was unable to convince anyone to build such a simulator for me, I embarked on the research myself.

1. Introduction.- 2. Background.- 3. Defect Models.- 4. Defect Statistics.- 5. Fault Analysis.- 6. VLASIC Implementation.- 7. Redundancy Analysis System.- 8. Fabrication Data.- 9. Conclusions and Current Research.- References.

Erscheint lt. Verlag 30.9.1987
Reihe/Serie The Springer International Series in Engineering and Computer Science ; 33
Zusatzinfo XII, 209 p.
Verlagsort New York
Sprache englisch
Maße 156 x 234 mm
Themenwelt Informatik Weitere Themen CAD-Programme
Technik Elektrotechnik / Energietechnik
ISBN-10 0-89838-244-0 / 0898382440
ISBN-13 978-0-89838-244-0 / 9780898382440
Zustand Neuware
Haben Sie eine Frage zum Produkt?
Mehr entdecken
aus dem Bereich
Band 1: Produktion

von Thomas Bauernhansl

Buch | Hardcover (2024)
Springer Vieweg (Verlag)
CHF 139,95
Einführung in die Geometrische Produktspezifikation

von Daniel Brabec; Ludwig Reißler; Andreas Stenzel

Buch | Softcover (2023)
Europa-Lehrmittel (Verlag)
CHF 27,90