Thermal Management of Electronic Systems

C.J. Hoogendoorn, etc., J.M. Burgers, R.A.W.M. Henkes, C.J.M. Lasance (Herausgeber)

Buch | Hardcover

348 Seiten

1994
Kluwer Academic Publishers (Verlag)
978-0-7923-2801-8 (ISBN)

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This volume presents an overview of recent developments in the thermal management of electronic systems. The topics covered include thermal management in general, thermally induced failure, channels and electronic components, measurement techniques, liquid cooling and thermal characterization.

This volume presents an overview of recent developments in the thermal management of electronic systems. This is increasingly recognized as an important factor in current design methodology. The topics covered include thermal management in general, thermally induced failure, numerical and experimental analysis of systems at various packaging levels, channels and electronic components, measurement techniques, liquid cooling, thermal characterization, thermal stress and die attach defects. This text is suitable for research and development engineers and scientists whose work involves the design and manufacture of electronic systems.

Invited Lectures; C.J.M. Lasance, A. Bar-Cohen, S. Witzman. Numerical and Experimental Analysis of Systems; S. Drake, M. White, A. Felthouse, C. Ganderton, S. Glanfield, J.D. Parry, D.G. Tatchell, H. Bruneel, B. Beernaert, G. Mortier, J. Declercq, B. Boesmans, W. Temmerman, W. Nelemans, E. Lauwers, J.L. Blanchard, J.M. Morelle, M. Misale. Numerical and Experimental Analysis of Channels; C. di Perna, A. Evangelisti, M. Paroncini, R. Ricci, J.B. Saulnier, H.Y. Wang, B. Fourka, O. Manca, S. Nardini, V. Naso. Numerical and Experimental Analysis of Electronic Parts; N. Ottavy, M. Bourhrara, J.-P. Le Jannou, P. Paris, G. Wachutka, J. Funk, H. Baltes, S. Mergui, F. Penot, J. Punch, M. Davies, J. Aklhoja, D. F. Grandjean, K. Nederveen. Measurement Techniques; R.P. Tye, R.L. Gardner, H.J.L. Vanlaer, C.J.M. Lasance, P. Rodgers, M. Davies. Liquid Cooling of Electronic Devices; B. Gromoll, K. Koeberle, H. Auracher, G. Guglielmini, M. Misale, C. Schenone. Thermal Characterization of Electronic Parts; T. Fromont, B. Boesmans, F. Christiaens, J. Berghmans, E. Beyne, E. Lauwers, A. Ackaert, K. Allaert, W. Temmerman, W. Nelemans, T. Goossens, M. Davies, J. Lohan, J. Punch, T. Moore, D. Liu, J. Barrett, S.C.O. Mathuna. Thermal Stress and Die Attach Defects; S. Witzman, D.E. Mix, A. Bar-Cohen, F. Michard, J.M. Dupont, H. Ribot, M. Salagoity.

Zusatzinfo	index
Sprache	englisch
Einbandart	gebunden
Themenwelt	Naturwissenschaften ► Physik / Astronomie ► Mechanik
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
ISBN-10	0-7923-2801-9 / 0792328019
ISBN-13	978-0-7923-2801-8 / 9780792328018
Zustand	Neuware