Thermal Management for Opto-electronics Packaging and Applications (eBook)

Xiaobing Luo, Run Hu, Bin Xie (Autoren)

eBook Download: EPUB

2024 | 1. Auflage
368 Seiten
Wiley (Verlag)
978-1-119-17929-0 (ISBN)

Infos

Thermal Management for Opto-electronics Packaging and Applications

A systematic guide to the theory, applications, and design of thermal management for LED packaging

In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design.

The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems.

The book also includes:

• A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials
• Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling
• Practical discussions of thermally enhanced thermal interfacial materials (TIMs)
• Complete treatments of hybrid thermal management in downhole devices

Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Xiaobing Luo, PhD, is a Full Professor at Huazhong University of Science and Technology, China. He has extensive experience as a Senior Engineer for Samsung Electronics in Seoul, Korea. His research interests include LED packaging, thermal management, and micropumps, and he has authored 110 academic papers.

Run Hu, PhD, is a Professor and Doctoral Supervisor at the School of Energy and Power Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Outstanding Youth Scholar and Chutian Scholar awards in Hubei province.

Bin Xie, PhD, is an Assistant Professor at the School of Mechanical Science and Engineering at the Huazhong University of Science and Technology, China. He was the recipient of the Natural Science Prize of Hubei Province (second class) and the Outstanding Paper Award from the International Conference on Electronic Packaging Technology (ICEPT).

Textauszug

List of Nomenclatures

Abbreviation

1D

one‐dimensional

2D

two‐dimensional

3D

three‐dimensional

α‐GaN

Α‐gallium nitride

β‐Ga2O3

Β‐zirconia

AM

arrangement followed by mixing method

APG

alkyl polyglucoside

AW

atmospheric transparent window

BeO

beryllium oxide

BG

bilayer graphene

BGA

ball grid array

BLT

bond line thickness

BN

boron nitride

BW

bandwidth

CB

conduction band

CCT

correlated color temperature

CFD

computational fluid dynamics

CFs

carbon fibers

CH2I2

diiodomethane

CIE

Commission Internationale de L'Eclairage

CLTE

coefficient of linear thermal expansion

CMOS

complementary metal‐oxide semiconductor

CMY

Cooper–Mikic–Yovanovich

CNC

computerized numerical control

CNT(s)

carbon nanotube(s)

Com‐film

luminescent films containing without hBN

Com‐WLEDs

common QDs‐WLEDs without hBN

CPCMs

composite phase change materials

CRC

colored radiative cooler

CRI

color‐rendering index

CS

crystal structure

CSF

cumulative structure function

CSP

chip‐scale package

CTAB

hexadecyl trimethyl ammonium bromide

CTE

coefficients of thermal expansion

CTMS

centralized thermal management system

CVD

chemical vapor deposition

DA

diffusion approximation

DAA

die attach adhesive

DBC

direct bonded copper substrates

DC

dielectric constants

DIP

dual in‐line package

DM

directly mixing without arrangement method

DMA

dynamic mechanical analysis

DPC

direct plate copper substrates

DQN

deep Q‐learning network

DRL

deep reinforcement learning

DSC

differential scanning calorimetry

DTMS

distributed thermal management system

EBL

electron blocking layer

ECB

electrical conductivity bandwidth

EDS

energy dispersive spectroscopy

EG

expanded graphite

EGE

epsilon greedy exploration

EL

electroluminescence

EMA

effective medium approximation

EQE

external quantum efficiency

ER

electrical resistivity

FCP

flip chip package

FEA

finite‐element analysis

FEM

finite‐element model

FES

finite‐element simulation

FLG

few‐layers graphene

FRTE

an extension of RTE integrated with fluorescence

FWHM

full‐width‐at‐half‐maximum

GA

genetic algorithm

GNP

graphene nanoplatelets

GNs

graphene nanosheets

GO

graphene oxide

GP

graphene

HAADF‐STEM

high‐angle‐annular‐dark‐field STEM

HBC

hybrid body cooling

hBN

hexagonal boron nitride

hBNPs

hexagonal boron nitride platelets

hBNS

hexagonal boron nitride sheets

HEC

hydroxyethyl cellulose

HG

Henyey–Greenstein

HP

heat pipe

HRTEM

high‐resolution transmission electron microscope

HTHP

high‐temperature and high‐pressure

IAM1.5

the standard AM 1.5 spectrum of solar radiation

IC(s)

integrated circuit(s)

IGBT(s)

insulated gate bipolar transistor(s)

iNEMI

international electronics manufacturing initiative

IQE

internal quantum efficiency

IR

infrared

Iso‐film

luminescent films containing with isotropic distributed hBN

Iso‐WLEDs

isotropic thermal conductive QDs‐WLEDs with isotropic arranging hBN

JAICIPM

jet array impingement cooling system with integrated piezoelectric micropump

JIBC

jet impingement body cooling

JISC

jet impingement surface cooling

KM

Kubelka–Munk

LDs

laser diodes

LE

luminous efficiency

LED(s)

light‐emitting diode(s)

LEE

light extraction efficiency

LERP

laser‐excited remote phosphor

LFA

laser flash analysis

LiAlO2

lithium aluminate

LM

lattice mismatch

MA

mixing followed by arrangement

MBAM

modified Bruggeman asymmetric model

MCE

mixed cellulose esters

MCM

multi‐chip module

MCPCB

metal core‐printed circuit board

MD

molecular dynamics

MDM

metal–dielectric–metal

mhBN

magnetically responsive hBN

mhBN‐silicone

Imhbn‐silicone

m‐MPMF

micro multiple piezoelectric magnetic fan

mohBN

modified hBN

MOSFET

metal‐oxide‐semiconductor field‐effect transistor

MPP

mesophase pitch

MQW

multiple quantum well

MWT

maximal working temperature

NICFs

nickel‐coated carbon fibers

PAN

polyacrylonitrile

PCB

printed circuit board

pc‐LD

phosphor‐converted laser diode

pc‐LED

phosphor‐converted light‐emitting diode

PCM(s)

phase change material(s)

PDMS

polydimethylsiloxane

PEEK

poly‐ether–ether–ketone

PET

photo‐electro‐thermal

PG

propylene glycol

PID

proportional–integral–derivative (controller)

PL

photoluminescence

PMMA

polymethyl methacrylate

PTMS

passive thermal management system

QDs

quantum dots

QDs‐WLEDs

QDs‐converted WLEDs

QE

quantum efficiency

QFP

quad flap package

QSNs

QDs‐silica coated nanoparticles

QY

quantum yield

RC

radiative cooling

RDL

redistribution layer

RE

relative error

RMSE

root mean square error

RTDs

resistance temperature detectors

RTE

radiative transfer equation

SAM

self‐assembled monolayer

SAM‐CH3

alkanethiol type SAM

SAM‐NH2

11‐amino‐1‐undecanethiol hydrochloride

SCMC

sodium carboxymethyl cellulose

SEM

scanning electron microscope

SiC

carborundum

SILAR

successive ionic layer adsorption and reaction

SLA

stereolithography

SLG

single‐layer graphene

SMD

Sauter mean diameter

SNTP

solid heat conduction, natural air convection, thermal radiation, and phase change processes

SOI

silicon‐on‐insulator

SP

solid heat conduction and phase change processes

SPD

spectral power distribution

SR

selective radiative cooling radiator

SRH

Shockley–Read–Hall

SSH

the sustainability of the image horizontal direction

SSV

the sustainability of the image in the vertical direction

STEM

scanning transmission electron microscope

TC

thermal camouflage

TCEE

thermal conductivity enhancement efficiency

TD

thermal diffusion coefficient

TEOS

tetraethyl orthosilicate

TES

thermal energy storage

TFFC

thin‐film flip‐chip

TG

thermal gravimetric analysis

TIM(s)

thermal interface material(s)

TIR

total internal reflection

TMA

thermal mechanical analysis

TmhBN‐silicone

through‐plane‐aligned mhBN‐silicone

TMM

transfer matrix method

TMR

thermal mismatch rate

TMS(s)

thermal management system(s)

TO

transistor outline

TOP

tri‐n‐octylphosphine

TRPL

time‐resolved PL

TSOP

thin small outline package

TSV

through silicon via

UHMR

ultrahigh magnetic response

UV

ultraviolet

VB

valance band

VC

vapor chamber

VCHP

variable conductance heat pipe

Ver‐film

luminescent films containing with vertical hBNSCMC templates

Ver‐WLEDs

vertical thermal conductive QDs‐WLEDs

...

Produkt-Details

• Erscheint lt. Verlag: 29.5.2024
• Sprache: englisch
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• ISBN-10: 1-119-17929-7 / 1119179297
• ISBN-13: 978-1-119-17929-0 / 9781119179290