Chiplet Design and Heterogeneous Integration Packaging

John H. Lau (Autor)

Buch | Hardcover

525 Seiten

2023 | 2023 ed.
Springer Verlag, Singapore
978-981-19-9916-1 (ISBN)

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The book focuses on the design, materials, process, fabrication, and reliability of chiplet design and heterogeneous integraton packaging. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as chip partitioning, chip splitting, multiple system and heterogeneous integration with TSV-interposers, multiple system and heterogeneous integration with TSV-less interposers, chiplets lateral communication, system-in-package, fan-out wafer/panel-level packaging, and various Cu-Cu hybrid bonding. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

For Internal Use Only: John H Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow, IMAPS Fellow Unimicron Technology Corporation, John_Lau@unimicron.com SPECIALIZED PROFESSIONAL COMPETENCIES [1] Design, analysis, materials, process, manufacturing, qualification, reliability, testing, and thermal management of electronic and optoelectronic components and systems. Fan-out/fan-in WLP, MEMS, LED, CIS, TSV, 3D IC integration, heterogeneous integration/SiP and SMT. Leadfree soldering, manufacturing, and solder joint reliability. [2] Manage R&D teams to develop new and useful technologies for semiconductor advanced packaging. [3] Provide recent advances and trends in advanced packaging to upper managements and guidance to young engineers and managers. Over 22 books (all are the first author), 517 peer-reviewed papers (out of which 375 are principal investigator), 40 issued and pending US patents (out of which 25 are principal inventor), and 325 keynotes/lectures.

State-of-the-Art of Advanced Packaging.- Chip Partition and Chip Split.- Multiple System and Heterogeneous Integration with TSV Interposers.- Multiple System and Heterogeneous Integration with TSV-Less Interposers.- Chiplets Lateral (Horizontal) Communications.- Cu-Cu Hybrid Bonding.

Erscheinungsdatum	20.04.2023
Zusatzinfo	501 Illustrations, color; 42 Illustrations, black and white; XXII, 525 p. 543 illus., 501 illus. in color.
Verlagsort	Singapore
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
Schlagworte	2.1D, 2.3D, and 3D IC integration • Bridges • Chiplet lateral communications • Chip partitioning • Chip splitting • Chitlet design • Hybrid bonding • Multiple system and heterogenous integration • Redistribution-layer • Through-Silicon Via
ISBN-10	981-19-9916-3 / 9811999163
ISBN-13	978-981-19-9916-1 / 9789811999161
Zustand	Neuware