BSIM-Bulk MOSFET Model for IC Design - Digital, Analog, RF and High-Voltage
Woodhead Publishing (Verlag)
978-0-323-85677-5 (ISBN)
Those working in the semiconductor industry often run into a variety of problems like model non-convergence or non-physical simulation results. This is largely due to a limited understanding of the internal operations of the model as literature and technical manuals are insufficient. This also creates huge difficulty in developing their own IP models. Similarly, circuit designers and researcher across the globe need to know new features available to them so that the circuits can be more efficiently designed.
Chenming Hu is TSMC Distinguished Chair Professor Emeritus at the University of California, Berkeley. He was the Chief Technology Officer of TSMC. He received the US Presidential Medal of Technology and Innovation from Pres. Barack Obama for developing the first 3D thin-body transistor FinFET, MOSFET reliability models and leading the development of BSIM industry standard transistor model that is used in designing most of the integrated circuits in the world. He is a member of the US Academy of Engineering, the Chinese Academy of Science, and Academia Sinica.He received the highest honor of IEEE, the IEEE Medal of Honor, and its Andrew Grove Award, Solid Circuits Award, and the Nishizawa Medal. He also received the Taiwan Presidential Science Prize and UC Berkeley’s highest honor for teaching - the Berkeley Distinguished Teaching Award. Harshit Agarwal received the PhD degree from Indian Institute of Technology Kanpur, India in 2017. He is currently working as center manager and post-doc fellow at Berkeley Device Modeling Centre, BSIM group, University of California Berkeley, Berkeley, USA. He has been involved in the development of multi-gate and bulk MOSFET models. He is also involved in the modeling and characterization of advanced steep sub-threshold slope devices like negative capacitance FETs, tunnel FET etc. He has authored several papers in the field of semiconductor device modeling, simulation and characterization. He is a Co-Developer of BSIM-BULK (formerly BSIM6) industry standard models for BULK-MOSFET. He has published 8 journal papers and 10 conference papers all on the development of the BSIM-BULK model. His current research interests include semiconductor device physics, modeling, and characterization. Yogesh Singh Chauhan is a Chair professor in the department of electrical engineering at Indian Institute of Technology Kanpur, India. He is the developer of several industry standard models: ASM-HEMT, BSIM-BULK (formerly BSIM6), BSIM-CMG, BSIM-IMG, BSIM4 and BSIM-SOI models. His research group is involved in developing compact models for GaN transistors, FinFET, Nanosheet/Gate-All-Around FETs, FDSOI transistors, Negative Capacitance FETs and 2D FETs. His research interests are RF characterization, modeling, and simulation of semiconductor devices. He is the Fellow of IEEE and Indian National Academy of Engineering. He is the Editor of IEEE Transactions on Electron Devices and Distinguished Lecturer of the IEEE Electron Devices Society. He is the chairperson of IEEE U.P. section and IEEE-EDS Compact Modeling Committee. He has published more than 400 papers in international journals and conferences. He received Ramanujan fellowship in 2012, IBM faculty award in 2013 and P. K. Kelkar fellowship in 2015, CNR Rao faculty award, Humboldt fellowship and Swarnajayanti fellowship in 2018. He has served in the technical program committees of IEEE International Electron Devices Meeting (IEDM), IEEE International Conference on Simulation of Semiconductor Processes and Devices (SISPAD), IEEE European Solid-State Device Research Conference (ESSDERC), IEEE Electron Devices Technology and Manufacturing (EDTM), and IEEE International Conference on VLSI Design and International Conference on Embedded Systems.
1. Background
2. BSIM-BULK Core Model
3. Real Device Effects
4. Leakage current and thermal effects
5. BSIM-BULK Charge and Capacitance Model
6. Noise and RF Modeling
7. Junction Diode and Layout Dependent Parasitic Model
8. Compact Modeling of High Voltage Devices
9. Parameter Extraction
10. BSIM-BULK Model Quality Testing
| Erscheinungsdatum | 05.05.2023 |
|---|---|
| Reihe/Serie | Woodhead Publishing Series in Electronic and Optical Materials |
| Zusatzinfo | Approx. 200 illustrations (200 in full color); Illustrations |
| Sprache | englisch |
| Maße | 152 x 229 mm |
| Gewicht | 1000 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| ISBN-10 | 0-323-85677-2 / 0323856772 |
| ISBN-13 | 978-0-323-85677-5 / 9780323856775 |
| Zustand | Neuware |
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