Three-Dimensional Integration and Modeling
Springer International Publishing (Verlag)
978-3-031-00575-6 (ISBN)
Jong-Hoon Lee received the B.S. Degree in electrical engineering from The Pennsylvania State University, University Park, with high honor in the spring of 2001. He joined the electrical engineering at The Georgia Institute of Technology, in the fall of 2001 and received an M.S. degree in the fall of 2004 and a Ph.D. in the summer of 2007 under the advice of Prof. Manos M. Tentzeris. Dr. Lee is now the senior CAE engineer at RFMD in the design integration department. His research interests are SOP and SIP packaging technologies for microwave/mmW systems, passive/active circuits for RF/wireless systems, DSP-based predictors to improve the computational 108 THREE-DIMENSIONAL INTEGRATION efficiency of the simulation of highly resonant RF geometries. Jong-Hoon Lee also researches the development of the LTCC system-on-package (SOP) module for millimeter-wave wireless systems, FDTD/Spice interface, and active devices modeling with FDTD and MRTD. He was a member of the Georgia Tech ATHENA research group, NSF packaging research center, the Georgia Electronic Design Center, and Tau Beta Pi Honor association.
Introduction.- Background on Technologies for Millimeter-Wave Passive Front-Ends.- Three-Dimensional Packaging in Multilayer Organic Substrates.- Microstrip-Type Integrated Passives.- Cavity-Type Integrated Passives.- Three-Dimensional Antenna Architectures.- Fully Integrated Three-Dimensional Passive Front-Ends.- References.
| Erscheinungsdatum | 06.06.2022 |
|---|---|
| Reihe/Serie | Synthesis Lectures on Computational Electromagnetics |
| Zusatzinfo | X, 108 p. |
| Verlagsort | Cham |
| Sprache | englisch |
| Maße | 191 x 235 mm |
| Gewicht | 243 g |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| ISBN-10 | 3-031-00575-9 / 3031005759 |
| ISBN-13 | 978-3-031-00575-6 / 9783031005756 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
aus dem Bereich
