Microelectronics Packaging Handbook

Semiconductor Packaging

R.R. Tummala, Eugene J. Rymaszewski, Alan G. Klopfenstein (Autoren)

Buch | Hardcover

1030 Seiten

1997 | 2nd ed. 1997
Chapman and Hall (Verlag)
978-0-412-08441-6 (ISBN)

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Electronics has become the largest industry, surpassing agriculture, auto, and heavy metal industries. It has become the industry of choice for a country to prosper, already having given rise to the phenomenal prosperity of Japan, Korea, Singapore, Hong Kong, and Ireland among others. At the current growth rate, total worldwide semiconductor sales will reach $300B by the year 2000. The key electronic technologies responsible for the growth of the industry include semiconductors, the packaging of semiconductors for systems use in auto, telecom, computer, consumer, aerospace, and medical industries, displays, magnetic, and optical storage as well as software and system technologies. There has been a paradigm shift, however, in these technologies, from mainframe and supercomputer applications at any cost, to consumer applications at approximately one-tenth the cost and size. Personal computers are a good example, going from $500IMIP when products were first introduced in 1981, to a projected $IIMIP within 10 years. Thin, light portable, user friendly and very low-cost are, therefore, the attributes of tomorrow's computing and communications systems. Electronic packaging is defined as interconnection, powering, cool ing, and protecting semiconductor chips for reliable systems. It is a key enabling technology achieving the requirements for reducing the size and cost at the system and product level.

Content.- 2. Microelectronics Packaging Handbook: Semiconductor Packaging.- 7. Microelectronics Packaging—An Overview.- 8. Chip-To-Package Interconnections.- >Chapter 9. Ceramic Packaging.- 10. Plastic Packaging.- 11. Polymers In Packaging.- 12. Thin-Film Packaging.- 13. Package Electrical Testing.- 14. Package Sealing And Encapsulation.- Glossary And Symbols.- Authors’ Biographies.

Reihe/Serie	Microelectronics Packaging Handbook, 3-part set \| 1.10
Zusatzinfo	LXX, 1030 p. In 2 volumes, not available separately.
Verlagsort	London
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Informatik ► Theorie / Studium ► Algorithmen
	Informatik ► Weitere Themen ► Hardware
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
ISBN-10	0-412-08441-4 / 0412084414
ISBN-13	978-0-412-08441-6 / 9780412084416
Zustand	Neuware