Guidebook for Managing Silicon Chip Reliability

Michael Pecht, Riko Radojcic, Gopal Rao (Autoren)

Buch | Softcover

224 Seiten

2019
CRC Press (Verlag)
978-0-367-40006-4 (ISBN)

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Achieving cost-effective performance over time requires an organized, disciplined, and time-phased approach to product design, development, qualification, manufacture, and in-service management. Guidebook for Managing Silicon Chip Reliability examines the principal failure mechanisms associated with modern integrated circuits and describes common practices used to resolve them.

This quick reference on semiconductor reliability addresses the key question: How will the understanding of failure mechanisms affect the future?

Chapters discuss:

failure sites, operational loads, and failure mechanism

intrinsic device sensitivities

electromigration

hot carrier aging

time dependent dielectric breakdown

mechanical stress induced migration

alpha particle sensitivity

electrostatic discharge (ESD) and electrical overstress

latch-up

qualification

screening

guidelines for designing reliability

Guidebook for Managing Silicon Chip Reliability focuses on device failure and causes throughout - providing a thorough framework on how to model the mechanism, test for defects, and avoid and manage damage. It will serve as an exceptional resource for electrical engineers as well as mechanical engineers working in the field of electronic packaging.

Pecht, Michael; Radojcic, Riko; Rao, Gopal

Introduction How Devices Fail Intrinsic Mechanisms Extrinsic Mechanisms Intrinsic Device Sensitivities Device Transconductance Sensitivities Leakage Current Sensitivities Breakdown Issues Electromigration Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Manage Hot Carrier Aging Description of the Mechanism Modeling of the Mechanism Detection of Hot Carrier Aging Avoidance of Hot Carrier Aging Time Dependent Dielectric Breakdown Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Avoid and Manage Mechanical Stress Induced Migration Description of the Mechanism Modeling of the Mechanism How to Detect/Test How to Manage Alpha Particle Sensitivity Description of the Mechanism Modeling of the Mechanism Prevention of Alpha Particle Induced Damage Electrostatic Discharge and Electrical Overstress Description of the Mechanism Modeling of the Mechanism Avoiding ESD/EOS Failures Latch-Up Description of the Mechanism How to Detect How to Avoid Qualification Qualification Testing Virtual Qualification Screening Functional Tests Burn-In Tests Iddq Tests Design for Reliability Design System Effective Management of Wear-Out Failures Extrinsic Reliability Mechanisms Infant Mortality Failure Mechanisms Circuit Sensitivities Summary

Erscheinungsdatum	11.10.2019
Verlagsort	London
Sprache	englisch
Maße	156 x 234 mm
Gewicht	453 g
Themenwelt	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
	Technik ► Umwelttechnik / Biotechnologie
ISBN-10	0-367-40006-5 / 0367400065
ISBN-13	978-0-367-40006-4 / 9780367400064
Zustand	Neuware