Designing Electronic Product Enclosures
Springer International Publishing (Verlag)
978-3-030-09887-2 (ISBN)
This book explains the design and fabrication of any electronic enclosure that contains a printed circuit board, from original design through materials selection, building and testing, and ongoing design improvement. It presents a thorough and lucid treatment of material physical properties, engineering, and compliance considerations such that readers will understand concerns that exist witha design (structural, environmental, and regulatory) and what is needed to successfully enter the marketplace. To this end, a main thrust of this volume is on the "commercialization" of electronic products when an enclosure is needed. The book targets the broadest audience tasked with design and manufacture of an enclosure for an electronic product, from mechanical/industrial engineers to designers and technicians. Compiling a wealth of information on relevant physical phenomena (strength of materials, shock and vibration, heat transfer), the book stands as a ready reference on how and where these key properties may be considered in the design of most electronic enclosures.
Tony Serksnis began his career in the drafting room of the Lincoln Electric Company running blueprints in 1964. He apprenticed as a tool and die designer while attending night school. After earning a Master's Degree in Mechanical Engineering from the University of Arizona in 1977, he joined the Material Fabrication Group at Lawrence Livermore National Laboratory. Was a part of the design team that built a precision lathe capable of 0.000001 inch accuracy. He then moved on to positions at Intel Corporation, Sytek Corporation, and Trimble Navigation. While at Trimble, he designed products for the Survey and Construction marketplaces. Later, managed Trimble's Mechanical Engineering Group and was responsible for budgeting, resourcing, prioritization, design and documentation, and project management.
Introduction and Author's Credentials.- Outline of Text.- Successful Design.- Building the Design.- Structural Considerations.
| Erscheint lt. Verlag | 16.12.2018 |
|---|---|
| Zusatzinfo | XXI, 211 p. 56 illus., 25 illus. in color. |
| Verlagsort | Cham |
| Sprache | englisch |
| Maße | 155 x 235 mm |
| Gewicht | 496 g |
| Themenwelt | Technik ► Maschinenbau |
| Schlagworte | Designing Enclosures • Designing Mechanical Enclosures • Enclosures for Electronic Products • Heat Mitigation in Electronics Enclosure • Packaging for Products • Product Enclosures • Vibration in Electronics Enclosure |
| ISBN-10 | 3-030-09887-7 / 3030098877 |
| ISBN-13 | 978-3-030-09887-2 / 9783030098872 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
aus dem Bereich
