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Multiphysics Simulation - Ercan M. Dede, Jaewook Lee, Tsuyoshi Nomura

Multiphysics Simulation

Electromechanical System Applications and Optimization
Buch | Softcover
212 Seiten
2016 | Softcover reprint of the original 1st ed. 2014
Springer London Ltd (Verlag)
978-1-4471-7024-2 (ISBN)
CHF 239,65 inkl. MwSt
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This book highlights a unique combination of numerical tools and strategies for handling the challenges of multiphysics simulation, with a specific focus on electromechanical systems as the target application. Features: introduces the concept of design via simulation, along with the role of multiphysics simulation in today’s engineering environment; discusses the importance of structural optimization techniques in the design and development of electromechanical systems; provides an overview of the physics commonly involved with electromechanical systems for applications such as electronics, magnetic components, RF components, actuators, and motors; reviews the governing equations for the simulation of related multiphysics problems; outlines relevant (topology and parametric size) optimization methods for electromechanical systems; describes in detail several multiphysics simulation and optimization example studies in both two and three dimensions, with sample numerical code.

Dr. Ercan M. Dede is a researcher and manager at the Toyota Research Institute of North America in Ann Arbor, MI, USA. Dr. Jaewook Lee is an Assistant Professor at the School of Aerospace and Mechanical Engineering of Korea Aerospace University, Goyang, South Korea. Dr. Tsuyoshi Nomura is a Senior Researcher at Toyota Central R&D Labs, Nagakute, Japan.

Introduction.- Overview of Physics for Electromechanical Systems.- Governing Equations for Electromechanical Systems.- Optimization Methods for Electromechanical Systems.- Electromechanical System Simulation and Optimization Studies.- Extensions to New Topics.- Appendix – Sample Multiphysics Optimization Code.

Erscheinungsdatum
Reihe/Serie Simulation Foundations, Methods and Applications
Zusatzinfo 80 Illustrations, color; 64 Illustrations, black and white; XVIII, 212 p. 144 illus., 80 illus. in color.
Verlagsort England
Sprache englisch
Maße 155 x 235 mm
Themenwelt Informatik Grafik / Design Digitale Bildverarbeitung
Mathematik / Informatik Informatik Theorie / Studium
Informatik Weitere Themen CAD-Programme
Mathematik / Informatik Mathematik Angewandte Mathematik
Mathematik / Informatik Mathematik Finanz- / Wirtschaftsmathematik
Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
Schlagworte Fluid • Magnetic • Multiphysics Simulation • thermal • thermal stress • Topology Optimization
ISBN-10 1-4471-7024-5 / 1447170245
ISBN-13 978-1-4471-7024-2 / 9781447170242
Zustand Neuware
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