Nanoindentation
Seiten
2002
Springer-Verlag New York Inc.
978-0-387-95394-6 (ISBN)
Springer-Verlag New York Inc.
978-0-387-95394-6 (ISBN)
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The focus in materials science has shifted towards designing materials at the sub-micron scale - the "nanotechnology" revolution - leading to more sensitive production and measuring requirements. This text is a reference tool that presents the underlying theory behind this technology.
As the focus in materials science shifts towards designing materials at the sub-micron scale - the "nanotechnology" revolution - it becomes increasingly important to characterize the mechanical properties of thin films and small volumes of material. The development of of nanoscale probes and ultrasensitive transducers for force and depth has made such measurements possible, and there are several commercially available instruments for making them. Such "nanoindentation" measurement devices are used in a wide variety of research and manufacturing areas, ranging from the fabrication and testing of silicon wafers in the electronics industry to the testing of hard coatings for cutting tools. This book presents the underlying theory behind the extraction of elastic modulus and hardness from the load-displacement data, discusses the significance of surface forces and adhesion, delineates the various corrections involved, and describes the methods of operation of the available instruments.
Self-contained, the treatment is aimed at those entering the field, but by bringing together material scattered widely throughout the research literature it should also provide a useful reference for those working in the field.
As the focus in materials science shifts towards designing materials at the sub-micron scale - the "nanotechnology" revolution - it becomes increasingly important to characterize the mechanical properties of thin films and small volumes of material. The development of of nanoscale probes and ultrasensitive transducers for force and depth has made such measurements possible, and there are several commercially available instruments for making them. Such "nanoindentation" measurement devices are used in a wide variety of research and manufacturing areas, ranging from the fabrication and testing of silicon wafers in the electronics industry to the testing of hard coatings for cutting tools. This book presents the underlying theory behind the extraction of elastic modulus and hardness from the load-displacement data, discusses the significance of surface forces and adhesion, delineates the various corrections involved, and describes the methods of operation of the available instruments.
Self-contained, the treatment is aimed at those entering the field, but by bringing together material scattered widely throughout the research literature it should also provide a useful reference for those working in the field.
Chapter 1. Contact Mechanics.- Chapter 2. Nanoindentation Testing.- Chapter 3. Analysis of Nanoindentation Test Data.- Chapter 4. Factors Affecting Nanoindentation Test Data.- Chapter 5. Simulation of Nanoindentation Test Data.- Chapter 6. Scaling Relationships in Nanoindentation.- Chapter 7. Methods of Nanoindentation Testing.- Chapter 8. Nanoindentation Test Standards.- Chapter 9. Nanoindentation Test Instruments.- Chapter 10. Examples of Nanoindentation Testing.- Appendix 1. Elastic Indentation Stress Fields.- Appendix 2. Surface Forces, Adhesion and Friction.- Appendix 3. Common Indenter Geometries.
| Zusatzinfo | 87 figures |
|---|---|
| Verlagsort | New York, NY |
| Sprache | englisch |
| Einbandart | gebunden |
| Themenwelt | Technik ► Maschinenbau |
| ISBN-10 | 0-387-95394-9 / 0387953949 |
| ISBN-13 | 978-0-387-95394-6 / 9780387953946 |
| Zustand | Neuware |
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