Materials for High-Density Electronic Packaging and Interconnection
National Academies Press (Verlag)
978-0-309-04233-8 (ISBN)
Committee on Materials for High-Density Electronic Packaging, Commission on Engineering and Technical Systems, National Research Council
1 FRONT MATTER; 2 EXECUTIVE SUMMARY; 3 1 INTRODUCTION; 4 2 MICROELECTRONIC SYSTEM TRENDS AND PACKAGING NEEDS; 5 3 PACKAGING STRATEGIES AND ASSOCIATED MATERIALS AND PROCESS REQUIREMENTS; 6 4 MATERIALS ISSUES; 7 5 SOME SPECIFIC MATERIALS; 8 6 ORGANIZATIONAL, FUNDING, AND POLICY ISSUES; 9 APPENDIX A: GLOSSARY OF SOME TERMS AND ACRONYMS USED IN THE REPORT; 10 APPENDIX B: SOME INDUSTRY COMPONENT DATA; 11 APPENDIX C: MICROPROCESSOR OPERATING AND STRUCTURAL PARAMETERS; 12 APPENDIX D: EXAMPLES OF DEVELOPMENTS IN BOARD TECHNOLOGIES; 13 APPENDIX E: MATERIALS PROPERTIES; 14 APPENDIX F: EXAMPLES OF MULTICHIP MODULES; 15 APPENDIX G: BIOGRAPHICAL SKETCHES OF COMMITTEE MEMBERS
| Erscheint lt. Verlag | 1.2.1990 |
|---|---|
| Verlagsort | Washington |
| Sprache | englisch |
| Maße | 216 x 279 mm |
| Themenwelt | Technik ► Elektrotechnik / Energietechnik |
| Technik ► Maschinenbau | |
| ISBN-10 | 0-309-04233-X / 030904233X |
| ISBN-13 | 978-0-309-04233-8 / 9780309042338 |
| Zustand | Neuware |
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