Characterization of Integrated Circuit Packaging Materials (eBook)

Thomas Moore (Herausgeber)

eBook Download: PDF

2013 | 1. Auflage
274 Seiten
Elsevier Science (Verlag)
978-1-4832-9234-2 (ISBN)

Infos

Chapters in this volume address important characteristics of IC packages. Analytical techniques appropriate for IC package characterization are demonstrated through examples of the measurement of critical performance parameters and the analysis of key technological problems of IC packages. Issues are discussed which affect a variety of package types, including plastic surface-mount packages, hermetic packages, and advanced designs such as flip-chip, chip-on-board and multi-chip models.

Inhalt

Front Cover 1
Characterization of Integrated Circuit Packaging Materials 4
Copyright Page 5
Table of Contents 6
Foreword 12
Preface to Series 14
Preface 15
Contributors 18
Chapter 1. IC Package Reliability Testing 20
1.1 Introduction 20
1.2 In-Process Quality Measurements 21
1.3 Package-Oriented Reliability Testing of Finished Devices:Moisture Testing 29
1.4 Package-Oriented Reliability Testing of Finished Devices:Thermal Cycle Testing 33
1.5 Reliability Test Preconditioning: A New Direction 42
1.6 Summary 44
References 44
Chapter 2. Mold Compound Adhesion and Strength 46
2.1 Introduction 46
2.2 Thermodynamic Consideration of Adhesion 47
2.3 Adhesive Strength for Various Mold Compound Types 50
2.4 Various Factors Which Influence Adhesion Strength 52
2.5 Role of Adhesion in Surface Mount Operations 62
2.6 Role of Adhesion in Package Reliability 67
2.7 Physical Characterization of Mold Compounds 68
2.8 Outlook for Future Mold Compounds 72
2.9 Summary 73
References 73
Chapter 3. Mechanical Stress in IC Packages 76
3.1 Introduction 76
3.2 Stress and Strain Relations: An Overview 77
3.3 Stress Generation in IC Packages 80
3.4 Tools for Stress Determination in IC Packages 82
3.5 Application of Techniques to IC Packaging Problems 83
3.6 Solder Joint Stress and the Coffin—Manson Relation 94
3.7 Summary 95
References 95
Chapter 4. Moisture Sensitivity and Delamination 98
4.1 Introduction 98
4.2 Moisture/Reflow Sensitivity Evaluations 100
4.3 Impact on Temperature-Cycle Performance 110
4.4 Impact on THB Performance 111
4.5 Moisture Desorption: Bake-Out 112
4.6 Summary 113
References 114
Chapter 5. Thermal Management 116
5.1 Introduction 116
5.2 IC Package Thermal Characteristics 118
5.3 Factors Affecting Package Thermal Resistance 124
5.4 Thermal Design Challenges of Multi-Chip Modules 134
5.5 Summary 135
References 137
Chapter 6. Electrical Performance of IC Packages 140
6.1 Introduction 140
6.2 Designing for Performance 142
6.3 Electrical Models for Packages and Interconnects 144
6.4 Propagation Delay and Packaging 146
6.5 Switching Noise 149
6.6 Signal Integrity 153
6.7 Crosstalk 154
6.8 Materials and Design Trends for High-Performance Packaging 157
6.9 Summary 162
References 162
Chapter 7. Solderability of Integrated Circuits 164
7.1 Introduction 164
7.2 Electronic Soldering Basics 165
7.3 IC Package Designs, Materials, and Solderability Test Methods 167
7.4 IC Solderability Defects 171
7.5 Solderability of IC Packages to PCBs 181
7.6 Summary 184
References 184
Chapter 8. Hermeticity and Joining in Ceramic IC Packages 186
8.1 Introduction 186
8.2 Materials for Hermetic IC Packaging 188
8.3 Hermeticity Testing—History 192
8.4 Theory of Hermeticity Testing 193
8.5 Gross-Leak Testing Methodology 196
8.6 Hermeticity Failure Analysis 197
8.7 Alternatives to Hermetic Packaging 201
8.8 Summary 202
References 203
Chapter 9. Advanced Interconnect Technologies 206
9.1 Introduction 206
9.2 MCM Technology Classifications 207
9.3 MCM Materials Selection 209
9.4 Die Mounting and Stress 217
9.5 Die Interconnection 220
9.6 MCM Packages 223
9.7 Summary 224
References 225
Appendix: Technique Summaries 227
Acoustic Microscopy (C-AM) 228
Atomic Absorption Spectrometry (AAS) 232
Auger Electron Spectroscopy (AES) 233
Ceramic Plate Test (CPT) for Evaluating the Solderability of IC Devices 234
Coulometric Method for Solderability Evaluation 237
Decapsulation Techniques 241
Differential Scanning Calorimetry (DSC) 244
Dynamic Mechanical Analysis 246
Dynamic Secondary Ion Mass Spectrometry (Dynamic SIMS) 248
Electron Probe X-Ray Microanalysis (EPMA) 249
Energy-Dispersive X-Ray Spectroscopy (EDS) 250
Finite Element Analysis (FEA) 251
Fourier Transform Infrared Spectroscopy (FTIR) 254
Inductively Coupled Plasma Mass Spectrometry (ICPMS) 255
Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES) 256
In Situ Strain Gauges 257
Ion Chromatography 259
Mechanical Testing in IC Packaging 262
Scanning Electron Microscopy (SEM) 266
Scanning Tunneling Microscopy (STM) and Scanning Force Microscopy (SFM) 267
Static Secondary Ion Mass Spectrometry (Static SIMS) 268
Thermogravimetric Analysis (TGA) 269
Thermomechanical Analysis (TMA) 271
Torsional Braid Analysis (TBA) 274
Wetting Balance Method to Evaluate the Solderability of IC Devices 277
X-Ray Laminography 279
X-Ray Photoeiectron Spectroscopy (XPS) 282
X-Ray Radiographic Inspection 283
Index 286

Produkt-Details

• Erscheint lt. Verlag: 22.10.2013
• Sprache: englisch
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• ISBN-10: 1-4832-9234-7 / 1483292347
• ISBN-13: 978-1-4832-9234-2 / 9781483292342