Thermal Management of Electronic Systems II

Proceedings of EUROTHERM Seminar 45, 20–22 September 1995, Leuven, Belgium

E. Beyne, C.J.M. Lasance, J. Berghmans (Herausgeber)

Buch | Softcover

361 Seiten

2012 | Softcover reprint of the original 1st ed. 1997
Springer (Verlag)
978-94-010-6318-0 (ISBN)

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For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.

1. Invited Lectures.- The Numerical Modelling of Heat Transfer in Electronic Systems : Challenges and Ideas of Answer.- DELPHI — A Status Report on the ESPRIT funded Project for the Creation and Validation of Thermal Models of Electronic Parts.- Temperature Effects on Reliability.- 2. Analytical and Computational Thermal Modeling.- Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications — Experimental Validation.- Conjugate Model of a Pinned-Finned Heat-sink Using a Hybrid Conductance and CFD Model within an Integrated MCAE Tool.- Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction between Three Integrated Circuits.- Heat Transfer in Tridimensional Plastic Packages Stacks of Memory Chips.- Electrothermal Simulation of Analogue Integrated Circuits with ETS.- Calculations of the Temperature Distribution throughout Electronic Equipments by the Boundary Element Method.- An Interactive Thermal Characterisation of Component Placement.- 3. Thermal Characterisation.- Thermal Characterization of Electronic Devices by means of Improved Boundary Condition Independent Compact Models.- Experimental Validation Methods for Thermal Models.- Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment.- Modelling of IC-Packages based on Thermal Characteristics.- Characterisation of Thermally Enhanced Plastic Packages.- Thermal Characterization of Multistripe Heterostructure Lasers.- Application of Thermal Territories for Air Cooled Circuit Board Design.- Thermal Impedance Evaluation for Industrial Power Profiles.- Thermal Characterisation and Modélisation of Multichip Modules using Standard Electronic Packages.- Measurement of Practical Thermal Resistance Values for Multi-CavitiesPower Hybrids (MCPH) in a Vacuum Environment.- 4. Single and Multi-Phase Convective Cooling.- Flow Boiling and Film Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components.- Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Package: Effect of Orientation of the Package.- High Performance Air Cooled Heat-sinks for Power Packages.- Thermal Control of Broadcast Transmitters by Air Cooled Cold Plates.- Natural Convection Experiments with Cuboids and Cylinders of Equal Area.- Natural Convection Heat Transfer of Metal Cuboids Flush-Mounted in a Horizontal Plate.- 5. Measurement Techniques.- Visualisation of Natural Convection in Inclined Heated Parallel Plates.- New Jedec Standards for Thermal Measurements: Review and Examples.- Experimental Study on Local Convective Heat Transfer from Protruding Cubical Components.- Modelling of Axial Fans for Electronic Equipment.- 6. Thermomechanical Modelling.- Thermal Degradation of Power Modules.- Thermal and Thermomechanical Modelling of Ball Grid Array Packages.- Thermal and Thermomechanical Evaluation of a “Chip in Moulded Interconnect Device”.- Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by means of Finite Element Analysis.- Author Index.

Zusatzinfo	XI, 361 p.
Verlagsort	Dordrecht
Sprache	englisch
Maße	160 x 240 mm
Themenwelt	Naturwissenschaften ► Physik / Astronomie ► Mechanik
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Fahrzeugbau / Schiffbau
ISBN-10	94-010-6318-4 / 9401063184
ISBN-13	978-94-010-6318-0 / 9789401063180
Zustand	Neuware