Metallized Plastics 3

Fundamental and Applied Aspects

Buch | Softcover

400 Seiten

2012 | Softcover reprint of the original 1st ed. 1992
Springer-Verlag New York Inc.
978-1-4613-6510-5 (ISBN)

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This volume chronicles the proceedings of the Third Symposium on Metallized Plastics: Fundamental and Applied Aspects held under the auspices of the Dielectric Science and Technology Division of the Electrochemical Society in Phoenix, Arizona, October 13-18, 1991. This series of symposia to address the subject of metallized plastics was initiated in 1988 and the premier symposium was held in Chicago, October 10-12, 1988, followed by the second event in Montreal, Canada, May 7-10, 1990. The rroceedings of these two symposia have been properly documented ,2. The third symposium was a huge success like the previous two events, and all this is testimonial to the brisk interest and high tempo of R&D activity in the fie14 of metallized plastics. This further bolsters our earlier thinking that there was a conspicuous need to hold symposia on this topic on a regular basis and the fourth is planned for May 16-21, 1993 in Honolulu, Hawaii. The study of metallized plastics constitutes an important human endeavor l and as pointed out earlier there are myriad applications of metallized plastics ranging from very commonplace to exotic. Also a survey of the recent literature will reveal that both the fundamental and applied aspects of metallized plastics are being pursued with great vigor.

I. Metallization Techniques and Properties of Metal Deposits.- The Application of a Polypyrrole Precoat for the Metallization of Printed Circuit Boards.- Photoselective Circuitization of Dielectrics Via Electroless Plating of Metals.- Plasma-Induced Deposition of Copper Films.- The Effects of Substrate Functional Groups on Conventional and Novel E1ectroless Catalysts.- Laser Speckle Detection of Surface Morphology in Molded Plastic Parts.- Development of a Generic Method to Metallize Plastics.- Palladium and Aluminum Thin Film Deposition on Thermally Sensitive Substrates from Organometallic Complexes.- Application of Metallized Plastic Electrodes for Electrowinning of Metals.- II. Investigation of Interfacial Interactions.- Model Studies of the Interface Between Metals and Polyimides.- Scanning Tunneling Microscopy of Metal/Polymer Interfaces.- “In Situ” XPS Investigation of Polymers Metallized by Evaporation.- Model Systems for the Cr/Polyimide Interface.- Interactions of Deposited Copper on COOH of 11-Mercaptoundecanoic Acid: An XPS Study.- XPS Investigation of the Interfacial Chemistry of Evaporated Silver on Plasma-Modified Polystyrene.- The Chemistry of Metal/Polymer Interface Formation: Relevance to Adhesion.- III. Plastic Surface Modifications.- A Study of Metallized Thermoplastic Films Following Gas Plasma Treatment.- Influence of Surface Treatments on the Metallization of Thermostable Polymers.- Oxygen Plasma Treatment of Fluorinated Polyimide: An X-ray Photoelectron Spectroscopy Study.- A Static SIMS Study of the Chemical Modifications Induced by Plasma and Flame Treatments at the Surface of Polyolefins.- Aluminium Metallization of Polypropylene Films Pretreated by a N2 or NH3 Nonequilibrium Plasma. Study of the Interface and Adhesion Measurements.-Aluminum Metallization of Polyimide Substrate.- IV. Adhesion Aspects of Metallized Plastics.- Adhesion Enhancement Using Ion Processing: Metallized Plastics.- The Influence of the Pretreatment on the Adhesion of Metallic Coatings on Plastics.- Effect of the Polymeric Substrate Temperature on the Adhesion and Morphology of Metal Layers.- An Electrochemical Means of Probing a Metal/Polymer Interface- -A Method for Deducing Mechanical and Chemical Adhesion Components.- Measurement and Control of Interface Strength and Mechanical Properties of Coatings by Laser Spallation Experiment.- The Adhesion Strength of Metal/Polyimide and Polyimide/Silicon Interfaces as Determined by the Blister Test.- Non-destructive Evaluation of Adhesion at Metal-Insulator Interfaces Based on Extremely-Low-Frequency Dielectric Spectroscopy.- About the Contributors.

Zusatzinfo	IX, 400 p.
Verlagsort	New York, NY
Sprache	englisch
Maße	178 x 254 mm
Themenwelt	Naturwissenschaften ► Chemie ► Anorganische Chemie
	Naturwissenschaften ► Chemie ► Organische Chemie
	Naturwissenschaften ► Chemie ► Physikalische Chemie
	Technik ► Maschinenbau
ISBN-10	1-4613-6510-4 / 1461365104
ISBN-13	978-1-4613-6510-5 / 9781461365105
Zustand	Neuware