Electronic Packaging Conference

IEEE Components Packaging & Manufacturing Technology Society, IEEE (Autoren)

Buch | Softcover

240 Seiten

1997 | 1997 ed.
I.E.E.E.Press (Verlag)
978-0-7803-4157-9 (ISBN)

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This text covers the 1997 Electronic Packaging Conference, which discussed packaging structures for performance-driven, high-speed and high complexity electronic systems. It includes such topics as: package design issues; on-chip interconnection issues; and switching systems.

Verlagsort	Piscataway NJ
Sprache	englisch
Maße	216 x 279 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-10	0-7803-4157-0 / 0780341570
ISBN-13	978-0-7803-4157-9 / 9780780341579
Zustand	Neuware