System-in-Package
Electrical and Layout Perspectives
Seiten
2011
now publishers Inc (Verlag)
978-1-60198-458-6 (ISBN)
now publishers Inc (Verlag)
978-1-60198-458-6 (ISBN)
Focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of System-in-Package (SiP). The book first introduces package technologies, and then presents SiP design flow and design exploration. Finally, it discusses details of beyond-die signal and power integrity and physical implementation.
With the increasing scalability of semiconductor processes, the higher-level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system.
This book focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as IO (input/output cell) placement and routing for redistribution layer, escape, and substrate. It is an invaluable reference for EDA researchers, professionals and graduate students.
With the increasing scalability of semiconductor processes, the higher-level of functional integration at the die level, and the system integration of different technologies needed for consumer electronics, System-in-Package (SiP) is the new advanced system integration technology, which integrates (or vertically stacks) within a single package multiple components such as CPU, digital logic, analog/mixed-signal, memory, and passive and discrete components in a single system.
This book focuses on electrical and layout perspectives, as opposed to discussing thermal and mechanic characteristics of SiP. It first introduces package technologies, and then presents SiP design flow and design exploration. Finally, the paper discusses details of beyond-die signal and power integrity and physical implementation such as IO (input/output cell) placement and routing for redistribution layer, escape, and substrate. It is an invaluable reference for EDA researchers, professionals and graduate students.
1: Introduction 2: IC Package Tutorial 3: System-in-Package Design Exploration 4: Placement and Routing for SiP. References
| Erscheint lt. Verlag | 30.6.2011 |
|---|---|
| Reihe/Serie | Foundations and Trends® in Electronic Design Automation |
| Verlagsort | Hanover |
| Sprache | englisch |
| Maße | 156 x 234 mm |
| Gewicht | 146 g |
| Themenwelt | Mathematik / Informatik ► Informatik ► Datenbanken |
| Mathematik / Informatik ► Informatik ► Theorie / Studium | |
| Technik ► Elektrotechnik / Energietechnik | |
| ISBN-10 | 1-60198-458-8 / 1601984588 |
| ISBN-13 | 978-1-60198-458-6 / 9781601984586 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
Mehr entdecken
aus dem Bereich
aus dem Bereich
Einführung in die Praxis der Datenbankentwicklung für Ausbildung, …
Buch | Softcover (2021)
Springer Fachmedien Wiesbaden GmbH (Verlag)
CHF 69,95
