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Proceedings E!4570 IPCTECH

New Generation of 3-D Integrated Passive Components & Microsystems in LTCC-Technology. Eureka Kick-off Meeting Vienna, 6th and 7th April 2010
Buch
212 Seiten
2011 | 1., Aufl.
Shaker (Verlag)
978-3-8322-9716-9 (ISBN)

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The presented Proceedings are an important result of the kick–off meeting organized within the scope of the EUREKA E!4750–Project “New Generation of 3D Integrated Passive Components and Microsystems in LTCC TECHnology” (6 to 8 of April 2010). The event was hosted by the Institute of Sensor and Actuator Systems, Vienna University of Technology. The kick–off meeting was held at the Austrian Trend Hotel Savoyen Vienna.

The kick–off meeting was attended by 23 researchers and engineers from project partners from Austria (Institute of Sensor and Actuator Systems and OnkoTec GmbH), Slovenia (Jožef Stefan Institute and HIPOT–RR), Poland (Institute of Electron Technology), and Serbia (Faculty of Technical Sciences). Representatives of research institutions and companies involved in the E!4750–Project presented their achievements and valuable research results.

Outstanding reviewers, Prof. Andrzej Dziedzic, Dr. Luc Federzoni, Prof. Per Johander, Prof. Alena Pietriková, Prof. Maria Prudenziati, and Prof. Ivan Szendiuch, helped us to achieve a high scientific level of the published articles. We are grateful for their dedication and professionalism.

We hope that the Proceedings are a useful publication for researchers, engineers, experts and others who deal in the very interesting field of integrated passive components and microsystems.
Reihe/Serie Berichte aus der Elektrotechnik
Sprache englisch
Maße 148 x 210 mm
Gewicht 318 g
Einbandart Paperback
Themenwelt Technik Elektrotechnik / Energietechnik
Schlagworte LTCC-Technology • microsytems • passive components
ISBN-10 3-8322-9716-2 / 3832297162
ISBN-13 978-3-8322-9716-9 / 9783832297169
Zustand Neuware
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