Nicht aus der Schweiz? Besuchen Sie lehmanns.de
Solder Joint Technology - King-Ning Tu

Solder Joint Technology

Materials, Properties, and Reliability

(Autor)

Buch | Softcover
370 Seiten
2010 | Softcover reprint of hardcover 1st ed. 2007
Springer-Verlag New York Inc.
978-1-4419-2284-7 (ISBN)
CHF 329,50 inkl. MwSt
  • Versand in 10-15 Tagen
  • Versandkostenfrei
  • Auch auf Rechnung
  • Artikel merken
Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, 2006. There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing. For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are serious issues. These reliability issues are quite complicated due to the combined effect of electrical, mechanical, chemical, and thermal forces on solder joints. To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are discussed.

Copper—Tin Reactions.- Copper–Tin Reactions in Bulk Samples.- Copper–Tin Reactions in Thin-Film Samples.- Copper–Tin Reactions in Flip Chip Solder Joints.- Kinetic Analysis of Flux-Driven Ripening of Copper–Tin Scallops.- Spontaneous Tin Whisker Growth: Mechanism and Prevention.- Solder Reactions on Nickel, Palladium, and Gold.- Electromigration and Thermomigration.- Fundamentals of Electromigration.- Electromigration in Flip Chip Solder Joints.- Polarity Effect of Electromigration on Solder Reactions.- Ductile–to-Brittle Transition of Solder Joints Affected by Copper–Tin Reaction and Electromigration.- Thermomigration.

Erscheint lt. Verlag 19.11.2010
Reihe/Serie Springer Series in Materials Science ; 92
Zusatzinfo XVI, 370 p.
Verlagsort New York, NY
Sprache englisch
Maße 155 x 235 mm
Themenwelt Technik Bauwesen
Technik Elektrotechnik / Energietechnik
Technik Maschinenbau
ISBN-10 1-4419-2284-9 / 1441922849
ISBN-13 978-1-4419-2284-7 / 9781441922847
Zustand Neuware
Haben Sie eine Frage zum Produkt?
Mehr entdecken
aus dem Bereich
Grundlagen und Vorgehensweisen

von Bernd Kochendörfer; Jens H. Liebchen; Markus G. Viering

Buch | Softcover (2021)
Springer Fachmedien Wiesbaden GmbH (Verlag)
CHF 53,15
Kommentar zu VOB/C ATV DIN 18340, ATV DIN 18299

von Volker Mänz; Thomas Schmid; Markus Weißert

Buch | Softcover (2024)
DIN Media (Verlag)
CHF 96,55