Handbook of Liquids-Assisted Laser Processing (eBook)
464 Seiten
Elsevier Science (Verlag)
978-0-08-055504-1 (ISBN)
Introduced in the 1980s, neutral liquids assisted laser processing (LALP) has proved to be advantageous in the cutting of heat-sensitive materials, shock peening of machine parts, cleaning of surfaces, fabrication of micro-optical components, and for generation of nanoparticles in liquids. The liquids used range from water through organic solvents to cryoliquids.
The primary aim of the book is to present the essentials of previous research (tabulated data of experimental conditions and results), and help researchers develop new processing and diagnostics techniques (presenting data of liquids and a review of physical phenomena associated with LALP). Engineers can use the research results and technological innovation information to plan their materials processing tasks.
Laser processing in liquids has been applied to a number of different tasks in various fields such as mechanical engineering, microengineering, chemistry, optics, and bioscience. A comprehensive glossary with definitions of the terms and explanations has been added.
The book covers the use of chemically inert liquids under normal conditions. Laser chemical processing examples are presented for comparison only.
- First book in this rapidly growing field impacting mechanical and micro/nano-engineering
- Covers different kinds of liquid-assisted laser processing of a large variety of materials
- Covers lasers emitting from UV to IR with pulse lengths down to femtoseconds
- Reviews over 500 scientific articles and 300 inventions and tabulates their main features
- Gives a qualitative and quantitative description of the physical phenomena associated with LALP
- Tabulates 61 parameters for 100 liquids
- Glossary of over 200 terms and abbreviations
Laser processing of solid materials has been commonly performed in gas ambient. Having the workpiece immersed into liquid, having a liquid film on it, or soaking the material with liquid gives several advantages such as removal of the debris, lowering the heat load on the workpiece, and confining the vapour and plasma, resulting in higher shock pressure on the surface. Introduced in the 1980s, neutral liquids assisted laser processing (LALP) has proved to be advantageous in the cutting of heat-sensitive materials, shock peening of machine parts, cleaning of surfaces, fabrication of micro-optical components, and for generation of nanoparticles in liquids. The liquids used range from water through organic solvents to cryoliquids. The primary aim of Handbook of Liquids-Assisted Laser Processing is to present the essentials of previous research (tabulated data of experimental conditions and results), and help researchers develop new processing and diagnostics techniques (presenting data of liquids and a review of physical phenomena associated with LALP). Engineers can use the research results and technological innovation information to plan their materials processing tasks. Laser processing in liquids has been applied to a number of different tasks in various fields such as mechanical engineering, microengineering, chemistry, optics, and bioscience. A comprehensive glossary with definitions of the terms and explanations has been added. The book covers the use of chemically inert liquids under normal conditions. Laser chemical processing examples are presented for comparison only. - First book in this rapidly growing field impacting mechanical and micro/nano-engineering- Covers different kinds of liquid-assisted laser processing of a large variety of materials- Covers lasers emitting from UV to IR with pulse lengths down to femtoseconds- Reviews over 500 scientific articles and 300 inventions and tabulates their main features- Gives a qualitative and quantitative description of the physical phenomena associated with LALP- Tabulates 61 parameters for 100 liquids- Glossary of over 200 terms and abbreviations
Front Cover 1
Handbook of Liquids-Assisted Laser Processing 4
Copyright Page 5
Contents 6
Foreword 10
Chapter 1 Introduction 12
1.1 LALP Chronology 15
1.2 Laser Processing and Analysis of Liquid Systems That Are Not Covered in This Book 17
1.3 Inventions in Liquids-Assisted Laser Processing 19
Chapter 2 Cleaning 22
2.1 Introduction 22
2.2 Principles of Liquids-Assisted Laser Cleaning 23
2.2.1 Particles removal by frontside laser irradiation (steam laser cleaning) 23
2.2.2 Particles removal by backside laser irradiation 23
2.2.3 Removal of particles by laser-generated acoustic waves in liquid 24
2.2.4 Liquid-assisted laser shock cleaning 24
2.2.5 Removal of particles by bubble collapse induced flow 24
2.2.6 Removal of surface layers by laser ablation/spallation in liquid 25
2.2.7 Removal of frozen gas and liquid layers from optical surfaces 26
2.2.8 Laser-generated shock wave enhanced scale removal 27
2.2.9 Removal of organic contaminants by water decomposition products 27
2.2.10 Cleaning of surfaces through contaminants dissolution in laser-generated supercritical solution 27
2.2.11 Dehydroxylation of a silica glass surface 27
2.2.12 Ice-assisted laser particles removal 28
2.3 Particles on Solid Surfaces 28
2.3.1 Adhesion phenomena and adhesion forces 28
2.3.2 Adhesion force theories considering the deformation of the particle and the substrate 36
2.4 Experimental Techniques in Laser Wet/Steam Cleaning Research 41
2.4.1 Preparation of particles covered surfaces 41
2.4.2 Application of liquid and monitoring the liquid film thickness and condition 42
2.4.3 Complete cleaning systems 44
2.4.4 Measuring and monitoring techniques in steam laser cleaning 44
2.5 Physics and Phenomenology of Liquids-Assisted Laser Removal of Particles from Surfaces 48
2.5.1 Detailed description of the standard steam cleaning process 48
2.5.2 Optical effects 48
2.5.3 Acceleration and inertial effects 48
2.5.4 Heating and phase change (absorbing substrate, non-absorbing liquid) 50
2.5.5 Hydrodynamic effects 54
2.5.6 Particles removal threshold and efficiency in steam laser cleaning 55
2.5.7 Effect of capillary condensed water in 'dry' laser cleaning 56
Chapter 3 Shock Processing 80
3.1 Introduction 80
3.2 Residual Stresses and Their Measurement 81
3.3 Laser Shock Peening 88
3.3.1 Introduction 88
3.3.2 Experimental techniques 88
3.3.3 Shock pressure 92
3.3.4 Shock propagation and wave phenomena 93
3.3.5 Shock-induced changes in materials 95
3.3.6 Mathematical models of laser shock peening 99
3.3.7 Applications of laser peening 114
3.4 Laser Shock Forming and Cladding 151
3.4.1 Forming 151
3.4.2 Cladding 151
3.5 Densification of Porous Materials 152
Chapter 4 Subtractive Processing 154
4.1 Frontside Machining 154
4.1.1 Introduction 154
4.1.2 Frontside micromachining 156
4.1.3 High-power laser underwater and water-assisted cutting 178
4.2 Liquid-Jet-Guided Laser Beam Machining 182
4.2.1 Applications and performance 185
4.2.2 Molten salt-jet-guided laser beam 185
4.3 Water at Backside of an Opaque Material 188
4.4 Backside Machining of Transparent Materials 188
4.4.1 Introduction 188
4.4.2 Technologies, phenomenology, and etching mechanisms 192
4.5 Machining of Liquid-Containing Materials 213
4.5.1 Rock drilling 213
4.5.2 Biological materials 214
4.6 Laser Cleaving of Crystals in Water and of Water-Containing Crystals 214
4.6.1 Breaking of single-crystal silicon wafers 214
4.6.2 Cleaving of protein crystals 214
Chapter 5 Generation and Modification of Particles 220
5.1 Introduction 220
5.2 Optical Properties of Small Particles 221
5.3 Experimental Techniques of Particles Generation 224
5.4 Metal Particles 225
5.4.1 Introduction 225
5.4.2 Mechanisms determining the particles size 225
5.4.3 Modification of suspending particles by laser irradiation 228
5.5 Inorganic Compound Particles 251
5.5.1 Hydrothermal growth 251
5.6 Silicon and Amorphous Carbon Particles 261
5.7 Diamond and DLC Particles and Films 261
5.8 Organic Particles 269
Chapter 6 Surface Modification, Deposition of Thin Films, Welding, and Cladding 272
6.1 Surface Modification 272
6.1.1 Modification of surfaces of inorganic materials 272
6.1.2 Modification surfaces of organic materials 273
6.2 Deposition and Transfer of Thin Films 273
6.2.1 Laser ablation deposition in water vapour 273
6.2.2 Laser ablation deposition using a liquid target 277
6.2.3 Laser ablation deposition using frozen target 283
6.2.4 Forward transfer from solution (LIFT, MDW) 284
6.3 Welding and Cladding Under Water 288
Chapter 7 Physics and Chemistry of Laser–Liquid–Solid Interactions 292
7.1 Laser Beams and Their Propagation 292
7.1.1 Properties of Gaussian beams 293
7.1.2 Reflection of light 296
7.1.3 Propagation of Gaussian beams 298
7.2 Phase Change Phenomena 299
7.2.1 Overall phenomenology 299
7.2.2 Vaporization from free liquid surfaces 300
7.2.3 Nucleation of vapour bubbles 301
7.2.4 Bubble dynamics 303
7.3 Optical Breakdown of Liquids and Plasma 306
7.3.1 Photoionization of a dielectric liquid 306
7.3.2 Cascade ionization (avalanche ionization) 307
7.3.3 Photoionization absorption coefficients of atoms 308
7.3.4 Thermal ionization 308
7.3.5 Diffusion loss of electrons from the plasma 308
7.3.6 Recombination loss 309
7.3.7 Thermal conductivity of the plasma 309
7.3.8 Rate equation for free electrons 309
7.3.9 Internal energy density of electrons and particles in plasma 310
7.3.10 Energy balance equation for electrons 310
7.3.11 Heat flux conducted from plasma to adjacent matter 311
7.3.12 Dependence of optical breakdown threshold on laser pulse length 311
7.3.13 Factors affecting the breakdown threshold in liquids 311
7.3.14 Temperatures and pressures at laser breakdown and ablation in water 312
7.4 Shock Waves in Liquids and Solids 313
7.5 Laser-Induced Reactions of Carbon with Organic Solvents and Water 317
7.5.1 Reactions of carbon with organic solvents 317
7.5.2 Reactions of carbon with water 319
7.6 Behaviour of Oxides in High Temperature Water and Water Vapour 319
Chapter 8 Liquids and Their Properties 326
8.1 Introduction 326
8.2 Properties of 100 Selected Liquids 343
8.3 Properties of Water 390
References 398
Glossary 434
A 434
B 435
C 436
D 437
E 438
F 439
G 439
H 440
I 441
K 441
L 442
M 443
N 445
O 445
P 445
R 446
S 446
T 449
U 450
V 450
W 451
Y 451
Z 451
Subject Index 452
A 452
B 452
C 453
D 454
E 454
F 455
G 455
H 455
I 455
J 456
K 456
L 456
M 456
N 457
O 458
P 458
Q 459
R 459
S 459
T 460
U 461
V 461
W 461
X 461
Y 461
Z 461
Liquids 462
A 462
B 462
C 463
D 463
E 463
F 463
G 463
H 464
I 464
K 464
L 464
M 464
N 464
O 465
P 465
S 465
T 465
V 465
W 465
X 465
Erscheint lt. Verlag | 7.7.2010 |
---|---|
Sprache | englisch |
Themenwelt | Sachbuch/Ratgeber |
Naturwissenschaften ► Chemie | |
Naturwissenschaften ► Physik / Astronomie ► Optik | |
Recht / Steuern ► Allgemeines / Lexika | |
Recht / Steuern ► EU / Internationales Recht | |
Technik ► Maschinenbau | |
ISBN-10 | 0-08-055504-7 / 0080555047 |
ISBN-13 | 978-0-08-055504-1 / 9780080555041 |
Haben Sie eine Frage zum Produkt? |
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