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Nanopackaging

Nanotechnologies and Electronics Packaging

James E. Morris (Herausgeber)

Buch | Hardcover

543 Seiten

2008 | 2009
Springer-Verlag New York Inc.
978-0-387-47325-3 (ISBN)

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Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement. “Nanopackaging” is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Nanopackaging: Nanotechnologies and Electronics Packaging.- Modelling Technologies and Applications.- Application of Molecular Dynamics Simulation in Electronic Packaging.- Advances in Delamination Modeling.- Nanoparticle Properties.- Nanoparticle Fabrication.- Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges.- Nanostructured Resistor Materials.- Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging.- Nanoconductive Adhesives.- Nanoparticles in Microvias.- Materials and Technology for Conductive Microstructures.- A Study of Nanoparticles in SnAg-Based Lead-Free Solders.- Nano-Underfills for Fine-Pitch Electronics.- Carbon Nanotubes: Synthesis and Characterization.- Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications.- Carbon Nanotubes for Thermal Management of Microsystems.- Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes.- Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes.- Nanowires in Electronics Packaging.- Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging.- Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities.- Nanoelectronics Landscape: Application, Technology, and Economy.- Errata.

From the reviews:

“This is an impressive work that provides a substantial and relatively in depth coverage of a wide range of electronics packaging and assembly related applications for nanotechnology. Each chapter concludes with a list of references that can be used by the reader to further investigate a particular subject and the book is well produced with good quality figures and illustrations. … I am pleased to be able to conclude this … Nanopackaging: Nanotechnologies and Electronics Packaging as ‘highly recommended’.” (Martin Goosey, Microelectronics International, Vol. 26 (3), 2009)

Zusatzinfo	XXI, 543 p.
Verlagsort	New York, NY
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Naturwissenschaften ► Chemie ► Physikalische Chemie
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
ISBN-10	0-387-47325-4 / 0387473254
ISBN-13	978-0-387-47325-3 / 9780387473253
Zustand	Neuware