Silicon Microchannel Heat Sinks

Theories and Phenomena

Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny (Autoren)

Buch | Hardcover

IX, 141 Seiten

2003
Springer Berlin (Verlag)
978-3-540-40181-0 (ISBN)

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There is significant current interest in new technologies for IC (Integrated Circuit) cooling, driven by the rapid increase in power densities in ICs and the trend towards high-density electronic packaging for applications throughout civilian and military markets. In accordance with Moore's Law, the number of transistors on 6 Intel Pentium microprocessors has increased from 7.5 x10 in 1997 (Pentium II) to 6 55 x10 in 2002 (Pentium 4). Considering the rapid increase in the integration density, thermal management must be well designed to ensure proper functionality of these high-speed, high-power chips. Forced air convection has been traditionally used to remove the heat through a finned heat sink and fan module. 2 Currently, with 82 W power dissipation rate, approximately 62 W/cm heat flux, from a Pentium 4 processor with 3.06 GHz core frequency, the noise generated from high rotating speed fans is approaching the limit of acceptable level for humans. However, the power dissipation from a single cost-performance chip is 2 expected to exceed 100 W/cm by the year 2005, when the air cooling has to be replaced by new cooling technologies. Among alternative cooling methods, the two-phase microchannel heat sink is one of the most promising solutions. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of such a device.

1 Introduction.- 2 Two-phase Microchannel Heat Sinks: Problems and Challenges.- 3 A Thermal Experimental System with Freestanding Microchannels.- 4 Measurements and Modeling of Two-phase Flow in Microchannels.- 5 Boiling Regimes and Transient Signals Associated with the Phase Change.- 6 Enhanced Nucleate Boiling in Microchannels.- 7 Conclusions.- Appendix A: Process Flow Chart for Single-channel Devices with Combined Heater and Thermometers.- Appendix B: Process Flow Chart for Single-channel Devices with Separate Heater and Thermometers.- References.

Erscheint lt. Verlag	26.11.2003
Reihe/Serie	Microtechnology and MEMS
Zusatzinfo	IX, 141 p. 96 illus., 4 illus. in color.
Verlagsort	Berlin
Sprache	englisch
Maße	155 x 235 mm
Gewicht	355 g
Themenwelt	Naturwissenschaften ► Physik / Astronomie ► Festkörperphysik
	Naturwissenschaften ► Physik / Astronomie ► Thermodynamik
	Technik ► Elektrotechnik / Energietechnik
Schlagworte	Cooling • Heat sink • heat transfer • Integrated circuit • Microchannel • Mikroelektronik • nucleation • Two-phase
ISBN-10	3-540-40181-4 / 3540401814
ISBN-13	978-3-540-40181-0 / 9783540401810
Zustand	Neuware