Enabling Technologies for 3-D Integration: Volume 970
Seiten
2007
Materials Research Society (Verlag)
978-1-55899-927-5 (ISBN)
Materials Research Society (Verlag)
978-1-55899-927-5 (ISBN)
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An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; and applications of 3-D integration.
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc…) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.
An emerging technology or device architecture called 3-D IC integration is based on the system performance gains that can be achieved by stacking and vertically interconnecting distinct device chips. The 3-D concept of replacing long 2-D interconnects with shorter vertical (3-D) interconnects has the potential to alleviate the well-known interconnect (RC) delay problem facing the semiconductor industry. Additional benefits of the 3-D concept for the IC maker include reduced die size and the ability to use distinct technologies (analog, logic, RF, etc…) on separate vertically interconnected layers. The 3-D concept, therefore, allows the integration of otherwise incompatible technologies, and offers significant advantages in performance, functionality, and form factor. Topics in this book include: fabrication of 3-D ICs; modeling, simulation and scaling of 3-D integrated devices; applications of 3-D integration; through wafer interconnects for 3-D packaging and interposer applications; bonding technology for 3-D integration; and enabling processes for 3-D integration.
| Erscheint lt. Verlag | 30.3.2007 |
|---|---|
| Reihe/Serie | MRS Proceedings |
| Zusatzinfo | Worked examples or Exercises |
| Sprache | englisch |
| Gewicht | 545 g |
| Themenwelt | Informatik ► Grafik / Design ► Digitale Bildverarbeitung |
| Technik ► Maschinenbau | |
| ISBN-10 | 1-55899-927-2 / 1558999272 |
| ISBN-13 | 978-1-55899-927-5 / 9781558999275 |
| Zustand | Neuware |
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