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VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence -

VLSI-SoC 2023: Innovations for Trustworthy Artificial Intelligence

31st IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2023, Sharjah, United Arab Emirates, October 16–18, 2023, Revised Extended Selected Papers
Buch | Hardcover
XI, 295 Seiten
2025
Springer International Publishing (Verlag)
978-3-031-70946-3 (ISBN)
CHF 119,80 inkl. MwSt
  • Noch nicht erschienen - erscheint am 17.01.2025
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This book contains revised and extended versions of a selection of  papers presented at the 31st IFIP WG 10.5/IEEE International Conference on the theme of VLSI-SoC Innovations for Trustworthy Artificial Intelligence, VLSI-SoC 2023, held in Sharjah, United Arab Emirates, during October 16-18, 2023.
The 15 full papers included in this volume were carefully revised and expanded from 77 papers submitted to the conference. This edited volume has been organized into four parts: architectures; accelerators; resiliency and robustness; and security and privacy -  and is representing cutting-edge research at the forefront of VLSI technology.

.- Architectures.

.- Synthesis of SFQ Circuits with Compound Gates.

.- Architecture-Compiler Co-Design for ReRAM-based Multi-Core CIM Architectures.

.- A Leap of Confidence: A Write-Intensity aware Prudent Page Migration for Hybrid Memories.

.- Efficient Depth Optimization in Quantum Addition and Modular Arithmetic with Ling Structure.

.- Accelerators.

.- Exploring Constrained-Modulus Modular Multipliers for Improved Area, Power and Flexibility.

.- Accelerating Large Kernel Convolutions with Nested Winograd Transformation.

.- A Unified and Energy-Efficient Depthwise Separable Convolution Accelerator.

.- Resiliency and Robustness .

.- Analyzing the Reliability of TCUs Through Micro-architecture and Structural Evaluations for Two Real Number Formats.

.- Advanced Quality Assurance Platform for Robust Process Design Kits.

.- FPGA-Implementation Techniques to Efficiently Test Application Readiness of Mixed-Signal Products.

.- Radiation Tolerant 14T SRAM Cell for Avionics Applications.

.- 3.125GS/s, 4.9 ENOB, 109 fJ/Conversion Time-Domain ADC for Backplane Interconnect.

.-Security and Privacy.

.- Enhancing HW-SW Confidentiality Verification for Embedded Processors with SoftFlow's Advanced Memory Range Feature.

.- Confidential Inference in Decision Trees.

.- Enhancing the Security of IJTAG network using Inherently Secure SIB.

Erscheint lt. Verlag 17.1.2025
Reihe/Serie IFIP Advances in Information and Communication Technology
Zusatzinfo XX, 293 p.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Themenwelt Mathematik / Informatik Informatik Software Entwicklung
Informatik Weitere Themen Hardware
Schlagworte Accelerators for Artificial Intelligence • Analog Design • Architectures • Cyber Physical Systems • Design for Test • Design for Trust • EDA • Emerging computing paradigms • In-memory computing • In-memory Computing • Integrated Circuits for Signal Processing and Communication • Integrated Circuits for Signal Processing and Communication • IOT • Logic Design • Mixed-signal Design • Network on Chip • sensors • System on chip • VLSI • VLSI circuits
ISBN-10 3-031-70946-2 / 3031709462
ISBN-13 978-3-031-70946-3 / 9783031709463
Zustand Neuware
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