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Systems, Software and Services Process Improvement -

Systems, Software and Services Process Improvement

30th European Conference, EuroSPI 2023, Grenoble, France, August 30 – September 1, 2023, Proceedings, Part II
Buch | Softcover
XXV, 315 Seiten
2023 | 1st ed. 2023
Springer International Publishing (Verlag)
978-3-031-42309-3 (ISBN)
CHF 104,80 inkl. MwSt
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This two-volume set constitutes the refereed proceedings of the 30th European Conference on Systems, Software and Services Process Improvement, EuroSPI 2023, held in Grenoble, France, in August-September 2023.

The 47 full papers presented were carefully reviewed and selected from 100 submissions. The papers are organized according to the following topical sections: SPI and emerging and multidisciplinary approaches to software engineering; digitalisation of industry, infrastructure and e-mobility; SPI and good/bad SPI practices in improvement; SPI and functional safety and cybersecurity; SPI and agile; SPI and standards and safety and security norms; sustainability and life cycle challenges; SPI and recent innovations; virtual reality and augmented reality.  

SPI and Agile.- SPI and Standards and Safety and Security Norms.- Sustainability and Life Cycle Challenges.- SPI and Recent Innovations.- Virtual Reality and Augmented Reality. 

Erscheinungsdatum
Reihe/Serie Communications in Computer and Information Science
Zusatzinfo XXV, 315 p. 96 illus., 79 illus. in color.
Verlagsort Cham
Sprache englisch
Maße 155 x 235 mm
Gewicht 528 g
Themenwelt Mathematik / Informatik Informatik
Mathematik / Informatik Mathematik Finanz- / Wirtschaftsmathematik
Schlagworte Agile software development • Capability Maturity Model • International standards • ISO/IEC 1207 • ISO/IEC 14504 • ISO/IEC 29110 • Process Engineering • process involvement • Process Management • Rapid Application Development • software development methods • Software engineering • software standards
ISBN-10 3-031-42309-7 / 3031423097
ISBN-13 978-3-031-42309-3 / 9783031423093
Zustand Neuware
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Buch | Softcover (2023)
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