3D Integration of Resistive Switching Memory
Seiten
2024
CRC Press (Verlag)
978-1-032-48950-6 (ISBN)
CRC Press (Verlag)
978-1-032-48950-6 (ISBN)
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This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures, to its applications.
This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications.
Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:
1: Associative Problems in Crossbar array and 3D architectures;
2: Selector Devices and Self-Selective Cells;
3: Integration of 3D RRAM;
4: Reliability Issues in 3D RRAM;
5: Applications of 3D RRAM beyond Storage.
The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
This book offers a thorough exploration of the three-dimensional integration of resistive memory in all aspects, from the materials, devices, array-level issues, and integration structures to its applications.
Resistive random-access memory (RRAM) is one of the most promising candidates for next-generation nonvolatile memory applications owing to its superior characteristics including simple structure, high switching speed, low power consumption, and compatibility with standard complementary metal oxide semiconductor (CMOS) process. To achieve large-scale, high-density integration of RRAM, the 3D cross array is undoubtedly the ideal choice. This book introduces the 3D integration technology of RRAM, and breaks it down into five parts:
1: Associative Problems in Crossbar array and 3D architectures;
2: Selector Devices and Self-Selective Cells;
3: Integration of 3D RRAM;
4: Reliability Issues in 3D RRAM;
5: Applications of 3D RRAM beyond Storage.
The book aspires to provide a relevant reference for students, researchers, engineers, and professionals working with resistive random-access memory or those interested in 3D integration technology in general.
Qing Luo received his Ph.D. from the Institute of Microelectronics, Chinese Academy of Sciences (IMECAS), Beijing, China, in 2017. He is currently Professor at the Key Laboratory of Microelectronics Devices and Integrated Technology in IMECAS. His research interests are emerging memory devices including resistive RAM devices and ferroelectric memory devices.
1. Introduction
Qing Luo
2.Associative Problems in Crossbar array and 3D architectures
Qing Luo
3. Selector Devices and Self-selective cells
Yaxin Ding, Qing Luo
4. Integration of 3D RRAM
Qing Luo
5. Reliability issues of the 3D Vertical RRAM
Tiancheng Gong, Dengyun Lei
6. Applications of 3D RRAM Beyond Storage
Xumeng Zhang, Xiaoxin Xu, Jianguo Yang
7. Conclusion
Qing Luo
| Erscheinungsdatum | 17.05.2023 |
|---|---|
| Reihe/Serie | Frontiers in Semiconductor Technology |
| Zusatzinfo | 1 Tables, black and white; 27 Line drawings, black and white; 33 Halftones, black and white; 60 Illustrations, black and white |
| Verlagsort | London |
| Sprache | englisch |
| Maße | 138 x 216 mm |
| Gewicht | 453 g |
| Themenwelt | Mathematik / Informatik ► Informatik ► Theorie / Studium |
| Technik ► Elektrotechnik / Energietechnik | |
| ISBN-10 | 1-032-48950-2 / 1032489502 |
| ISBN-13 | 978-1-032-48950-6 / 9781032489506 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
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