Microscale and Nanoscale Heat Transfer

Analysis, Design, and Application

Mourad Rebay, Sadik Kakaç, Renato M. Cotta (Herausgeber)

Buch | Hardcover

487 Seiten

2016
Crc Press Inc (Verlag)
978-1-4987-3630-5 (ISBN)

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Microscale and Nanoscale Heat Transfer: Analysis, Design, and Applications features contributions from prominent researchers in the field of micro- and nanoscale heat transfer and associated technologies and offers a complete understanding of thermal transport in nano-materials and devices. Nanofluids can be used as working fluids in thermal systems; the thermal conductivity of heat transfer fluids can be increased by adding nanoparticles in fluids. This book provides details of experimental and theoretical investigations made on nanofluids for use in the biomechanical and aerospace industries. It examines the use of nanofluids in improving heat transfer rates, covers the numerical approaches for computational fluid dynamics (CFD) simulation of nanofluids, and reviews the experimental results of commonly used nanofluids dispersed in both spherical and nonspherical nanoparticles. It also focuses on current and developing applications of microscale and nanoscale convective heat transfer.

In addition, the book covers a wide range of analysis that includes:

Solid–liquid interface phonon transfer at the molecular level
The validity of the continuum hypothesis and Fourier law in nanochannels
Conventional methods of using molecular dynamics (MD) for heat transport problems
The molecular dynamics approach to calculate interfacial thermal resistance (ITR)
A review of experimental results in the field of heat pipes and two-phase flows in thermosyphons
Microscale convective heat transfer with gaseous flow in ducts
The application of the lattice Boltzmann method for thermal microflows
A numerical method for resolving the problem of subcooled convective boiling flows in microchannel heat sinks
Two-phase boiling flow and condensation heat transfer in mini/micro channels, and more

Microscale and Nanoscale Heat Transfer: Analysis, Design, and Applications

addresses the need for thermal packaging and management for use in cooling electronics and serves as a resource for researchers, academicians, engineers, and other professionals working in the area of heat transfer, microscale and nanoscale science and engineering, and related industries.

Mourad Rebay, Sadik Kakac, Renato M. Cotta

Interface Resistance and Thermal Transport in Nano-Confined Liquids. Molecular Dynamics Simulations for Water-Metal Interfacial Thermal Resistance. Convective Heat Transfer Enhancement with Nanofluids: A State-of-the-Art Review. Heat Conduction in Nanofluids. Thermophysical Properties of Nanofluids. Stability of Nanofluids: Fundamentals, State-of-the-Art, and Potential Applications. Numerical Approaches for Convective Heat Transfer with Nanofluids. Heat Pipes and Nanotechnologies. Nanofluid Flow Simulation as the Flow through the Porous Media. Convective Heat Transfer with Gaseous Flow in Microducts. Numerical Simulation of Combined Microscale Effects on Convective Heat Transfer in Single-Phase Flows. Numerical and Experimental Studies of Liquid and Gas Flow and Heat Transfer in Microchannel and Nozzle. Analytical-Numerical Solutions for Conjugated Heat Transfer in Multistream Microsystems. Direct-Inverse Problem Analysis in the Thermal Characterization of Microsystems. Application of the Lattice Boltzmann Method (LBM) to Thermal Microflows. Heat and Fluid Flow of Gases in Porous Media with Micropores: Slip Flow Regime. Numerical Analysis of Subcooled Convective Boiling in Microchannels. Two-Phase Flow in Microchannels.

Erscheint lt. Verlag	1.2.2016
Zusatzinfo	53 Tables, black and white; 21 Illustrations, color; 252 Illustrations, black and white
Verlagsort	Bosa Roca
Sprache	englisch
Maße	178 x 254 mm
Gewicht	1406 g
Themenwelt	Mathematik / Informatik ► Mathematik ► Angewandte Mathematik
	Naturwissenschaften ► Physik / Astronomie ► Strömungsmechanik
	Naturwissenschaften ► Physik / Astronomie ► Thermodynamik
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
ISBN-10	1-4987-3630-0 / 1498736300
ISBN-13	978-1-4987-3630-5 / 9781498736305
Zustand	Neuware