The Core Test Wrapper Handbook

Rationale and Application of IEEE Std. 1500™

Francisco Da Silva, Teresa McLaurin, Tom Waayers (Autoren)

Buch | Softcover

276 Seiten

2014
Springer-Verlag New York Inc.
978-1-4899-8769-3 (ISBN)

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In the early to mid-1990's while working at what was then Motorola Se- conductor, business changes forced my multi-hundred dollar microprocessor to become a tens-of-dollars embedded core. I ran into first hand the problem of trying to deliver what used to be a whole chip with something on the order of over 400 interconnect signals to a design team that was going to stuff it into a package with less than 220 signal pins and surround it with other logic. I also ran into the problem of delivering microprocessor specification verifi- tion – a microprocessor is not just about the functions and instructions included with the instruction set, but also the MIPs rating at some given f- quency. I faced two dilemmas: one, I could not deliver functional vectors without significant development of off-core logic to deal with the reduced chip I/O map (and everybody's I/O map was going to be a little different); and two, the JTAG (1149. 1) boundary scan ring that was around my core when it was a chip was going to be woefully inadequate since it did not support - speed signal application and capture and independent use separate from my core. I considered the problem at length and came up with my own solution that was predominantly a separate non-JTAG scan test wrapper that supported at-speed application of launch-capture cycles using the system clock. But my problems weren't over at that point either.

What is the IEEE 1500 Standard?.- Why use the IEEE 1500 Standard?.- Illustration Example.- Design of the IEEE 1500 Interface Port.- Instruction Types.- Design of the WBR.- Design of the WBY.- Design of the WIR.- Hierarchical Cores.- Finalizing the Wrapper Solution for the EX Core.- SOC Integration of 1500 Compliant Cores.

Erscheint lt. Verlag	20.10.2014
Reihe/Serie	Frontiers in Electronic Testing ; 35
Zusatzinfo	XXIX, 276 p.
Verlagsort	New York
Sprache	englisch
Maße	155 x 235 mm
Themenwelt	Informatik ► Weitere Themen ► CAD-Programme
	Informatik ► Weitere Themen ► Hardware
	Technik ► Elektrotechnik / Energietechnik
	Technik ► Maschinenbau
ISBN-10	1-4899-8769-X / 148998769X
ISBN-13	978-1-4899-8769-3 / 9781489987693
Zustand	Neuware