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Heterogeneous Multicore Processor Technologies for Embedded Systems - Kunio Uchiyama, Fumio Arakawa, Hironori Kasahara, Tohru Nojiri, Hideyuki Noda

Heterogeneous Multicore Processor Technologies for Embedded Systems

Buch | Softcover
224 Seiten
2014 | 2012 ed.
Springer-Verlag New York Inc.
978-1-4899-8740-2 (ISBN)
CHF 167,95 inkl. MwSt
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Based on a six-year evaluation project, this volume provides a single-source reference that covers both hardware and software issues in the latest heterogeneous multicore technologies, essential for devices such as mobile phones and in-car navigation systems.
To satisfy the higher requirements of digitally converged embedded systems, this book describes heterogeneous multicore technology that uses various kinds of low-power embedded processor cores on a single chip. With this technology, heterogeneous parallelism can be implemented on an SoC, and greater flexibility and superior performance per watt can then be achieved. This book defines the heterogeneous multicore architecture and explains in detail several embedded processor cores including CPU cores and special-purpose processor cores that achieve highly arithmetic-level parallelism. The authors developed three multicore chips (called RP-1, RP-2, and RP-X) according to the defined architecture with the introduced processor cores. The chip implementations, software environments, and applications running on the chips are also explained in the book.



Provides readers an overview and practical discussion of heterogeneous multicore technologies from both a hardware and softwarepoint of view;
Discusses a new, high-performance and energy efficient approach to designing SoCs for digitally converged, embedded systems;
Covers hardware issues such as architecture and chip implementation, as well as software issues such as compilers, operating systems, and application programs;
Describes three chips developed according to the defined heterogeneous multicore architecture, including chip implementations, software environments, and working applications.

Background.- Heterogeneous Multicore Architecture.- Processor Cores.- Chip Implementations.- Software Environments.- Application Programs and Systems.

Zusatzinfo XII, 224 p.
Verlagsort New York
Sprache englisch
Maße 155 x 235 mm
Themenwelt Informatik Weitere Themen CAD-Programme
Technik Elektrotechnik / Energietechnik
Schlagworte Embedded Systems
ISBN-10 1-4899-8740-1 / 1489987401
ISBN-13 978-1-4899-8740-2 / 9781489987402
Zustand Neuware
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