Microelectronics Manufacturing Diagnostics Handbook
Seiten
2012
|
Softcover reprint of the original 1st ed. 1993
Springer-Verlag New York Inc.
978-1-4613-5840-4 (ISBN)
Springer-Verlag New York Inc.
978-1-4613-5840-4 (ISBN)
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. The information modem manufacturing world, and high-quality captured here is world class. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
The world of microelectronics is filled with cusses measurement systems, manufacturing many success stories. From the use of semi control techniques, test, diagnostics, and fail ure analysis. It discusses methods for modeling conductors for powerful desktop computers to their use in maintaining optimum engine per and reducing defects, and for preventing de formance in modem automobiles, they have fects in the first place. The approach described, clearly improved our daily lives. The broad while geared to the microelectronics world, has useability of the technology is enabled, how applicability to any manufacturing process of similar complexity. The authors comprise some ever, only by the progress made in reducing their cost and improving their reliability. De of the best scientific minds in the world, and fect reduction receives a significant focus in our are practitioners of the art. The information modem manufacturing world, and high-quality captured here is world class. I know you will diagnostics is the key step in that process. find the material to be an excellent reference in of product failures enables step func Analysis your application. tion improvements in yield and reliability. which works to reduce cost and open up new Dr. Paul R. Low applications and technologies. IBM Vice President and This book describes the process ofdefect re of Technology Products General Manager duction in the microelectronics world.
1 Introduction.- 2 Manufacturing Yield.- 3 Problem Diagnostics.- 4 Manufacturing Defect Classification System.- 5 Product Dimensional Metrology and Pattern Defect Inspection.- 6 Process and Tool Monitoring.- 7 Contamination Monitoring.- 8 Repair and Rework.- 9 Test Sites and Vehicles For Yield and Process Monitoring.- 10 In-Line Electrical Test.- 11 Final Test.- 12 Traceability.- 13 Failure Analysis of Semiconductor Dvices.- 14 Materials and Chemical Analysis of Electronic Devices.- 15 Modeling for Manufacturing Diagnostics.- 16 Artificial Intelligence Techniques for Analysis: Expert Systems and Neural Networks.- 17 Statistical Quality Control.- 18 Reliability/Defect Severity.- 19 Burn-In.- 20 Defect Prevention.
| Zusatzinfo | XXXIII, 633 p. |
|---|---|
| Verlagsort | New York, NY |
| Sprache | englisch |
| Maße | 178 x 254 mm |
| Themenwelt | Informatik ► Theorie / Studium ► Algorithmen |
| Informatik ► Weitere Themen ► Hardware | |
| Technik ► Maschinenbau | |
| ISBN-10 | 1-4613-5840-X / 146135840X |
| ISBN-13 | 978-1-4613-5840-4 / 9781461358404 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
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