Power Distribution Networks with On-Chip Decoupling Capacitors (eBook)

Mikhail Popovich, Andrey Mezhiba, Eby G. Friedman (Autoren)

eBook Download: PDF

2007 | 2008
XXXII, 516 Seiten
Springer US (Verlag)
978-0-387-71601-5 (ISBN)

Infos

This book provides insight into the behavior and design of power distribution systems for high speed, high complexity integrated circuits. Also presented are criteria for estimating minimum required on-chip decoupling capacitance. Techniques and algorithms for computer-aided design of on-chip power distribution networks are also described; however, the emphasis is on developing circuit intuition and understanding the principles that govern the design and operation of power distribution systems.

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Power Distribution Networks with On-Chip Decoupling Capacitors is dedicated to distributing power in high speed, high complexity integrated circuits with power levels exceeding tens of watts and the power supply below a volt. The book provides insight and intuition into the behavior and design of integrated circuit-based power distribution systems.The book has three primary objectives. The first is to describe the impedance characteristics of the overall power distribution system, from the voltage regulator through the printed circuit board and package onto the integrated circuit to the power terminals of the on-chip circuitry. The second is to discuss the inductive characteristics of on-chip power distribution grids and the related circuit behavior of these structures. The third objective is to present design methodologies for effciently placing on-chip decoupling capacitors in nanoscale integrated circuits.Power Distribution Networks with On-Chip Decoupling Capacitors is a reference for professional engineers in the fields of circuits and systems and computer-aided design.

Inhalt

Preface 6
Acknowledgments 8
Contents 9
List of Figures 17
List of Tables 29
1 Introduction 31
1.1 Evolution of integrated circuit technology 33
1.2 Evolution of design objectives 37
1.3 The problem of power distribution 40
1.4 Deleterious effects of power distribution noise 47
1.5 Book outline 50
2 Inductive Properties of Electric Circuits 56
2.1 Definitions of inductance 57
2.2 Variation of inductance with frequency 72
2.3 Inductive behavior of circuits 81
2.4 Inductive properties of on-chip interconnect 83
2.5 Summary 87
3 Properties of On-Chip Inductive Current Loops 88
3.1 Introduction 88
3.2 Dependence of inductance on line length 89
3.3 Inductive coupling between two parallel loop segments 96
3.4 Application to circuit analysis 97
3.5 Summary 98
4 Electromigration 100
4.1 Physical mechanism of electromigration 101
4.2 Electromigration-induced mechanical stress 104
4.3 Steady state limit of electromigration damage 105
4.4 Dependence of electromigration lifetime on the line dimensions 107
4.5 Statistical distribution of electromigration lifetime 110
4.6 Electromigration lifetime under AC current 111
4.7 Electromigration in novel interconnect technologies 112
4.8 Designing for electromigration reliability 114
4.9 Summary 115
5 High Performance Power Distribution Systems 116
5.1 Physical structure of a power distribution system 117
5.2 Circuit model of a power distribution system 118
5.3 Output impedance of a power distribution system 121
5.4 A power distribution system with a decoupling capacitor 124
5.5 Hierarchical placement of decoupling capacitance 130
5.6 Resonance in power distribution networks 137
5.7 Full impedance compensation 143
5.8 Case study 145
5.9 Design considerations 148
5.10 Limitations of the one-dimensional circuit model 150
5.11 Summary 153
6 Decoupling Capacitance 154
6.1 Introduction to decoupling capacitance 155
6.2 Impedance of power distribution system with decoupling capacitors 162
6.3 Intrinsic vs intentional on-chip decoupling capacitance 174
6.4 Types of on-chip decoupling capacitors 181
6.5 On-chip switching voltage regulator 200
6.6 Summary 202
7 On-chip Power Distribution Networks 204
7.1 Styles of on-chip power distribution networks 205
7.2 Die-package interface 213
7.3 Other considerations 218
7.4 Summary 220
8 Computer-Aided Design and Analysis 221
8.1 Design flow for on-chip power distribution networks 222
8.2 Linear analysis of power distribution networks 227
8.3 Modeling power distribution networks 229
8.4 Characterizing the power current requirements of on- chip circuits 235
8.5 Numerical methods for analyzing power distribution networks 238
8.6 Allocation of on-chip decoupling capacitors 245
8.7 Summary 251
9 Inductive Properties of On-Chip Power Distribution Grids 253
9.1 Power transmission circuit 253
9.2 Simulation setup 256
9.3 Grid types 256
9.4 Inductance versus line width 261
9.5 Dependence of inductance on grid type 262
9.6 Dependence of Inductance on grid dimensions 264
9.7 Summary 269
10 Variation of Grid Inductance with Frequency 270
10.1 Analysis approach 270
10.2 Discussion of inductance variation 272
10.3 Summary 277
11 Inductance/Area/Resistance Tradeoffs 279
11.1 Inductance vs. resistance tradeoff under a constant grid area constraint 279
11.2 Inductance vs. area tradeoff under a constant grid resistance constraint 284
11.3 Summary 286
12 Scaling Trends of On- Chip Power Distribution Noise 288
12.1 Prior work 289
12.2 Interconnect characteristics 291
12.3 Model of power supply noise 297
12.4 Power supply noise scaling 299
12.5 Implications of noise scaling 306
12.6 Summary 307
13 Impedance Characteristics of Multi- Layer Grids 309
13.1 Electrical properties of multi-layer grids 311
13.2 Case study of a two layer grid 316
13.3 Design implications 325
13.4 Summary 326
14 Multiple On-Chip Power Supply Systems 328
14.1 ICs with multiple power supply voltages 329
14.2 Challenges in ICs with multiple power supply voltages 334
14.3 Optimum number and magnitude of available power supply voltages 339
14.4 Summary 344
15 On-Chip Power Distribution Grids with Multiple Supply Voltages 346
15.1 Background 348
15.2 Simulation setup 349
15.3 Power distribution grid with dual supply and dual ground 351
15.4 Interdigitated grids with DSDG 354
15.5 Paired grids with DSDG 358
15.6 Simulation results 363
15.7 Design implications 379
15.8 Summary 381
16 Decoupling Capacitors for Multi-Voltage Power Distribution Systems 383
16.1 Impedance of a power distribution system 385
16.2 Case study of the impedance of a power distribution system 393
16.3 Voltage transfer function of power distribution system 398
16.4 Case study of the voltage response of a power distribution system 403
16.5 Summary 411
17 On-chip Power Noise Reduction Techniques in High Performance ICs 412
17.1 Ground noise reduction through an additional low noise on- chip ground 414
17.2 Dependence of ground bounce reduction on system parameters 416
17.3 Summary 421
18 Effective Radii of On-Chip Decoupling Capacitors 423
18.1 Background 425
18.2 Effective radius of on-chip decoupling capacitor based on a target impedance 427
18.3 Estimation of required on-chip decoupling capacitance 429
18.4 Effective radius as determined by charge time 436
18.5 Design methodology for placing on-chip decoupling capacitors 442
18.6 Model of on-chip power distribution network 442
18.7 Case study 445
18.8 Design implications 451
18.9 Summary 452
19 Efficient Placement of Distributed On-Chip Decoupling Capacitors 454
19.1 Technology constraints 455
19.2 Placing on-chip decoupling capacitors in nanoscale ICs 456
19.3 Design of a distributed on-chip decoupling capacitor network 459
19.4 Design tradeoffs in a distributed on-chip decoupling capacitor network 464
19.5 Design methodology for a system of distributed on- chip decoupling capacitors 469
19.6 Case study 472
19.7 Summary 476
20 Impedance/Noise Issues in On- Chip Power Distribution Networks 478
20.1 Scaling effects in chip-package resonance 479
20.2 Propagation of power distribution noise 482
20.3 Local inductive behavior 484
20.4 Summary 488
21 Conclusions 490
Appendices 494
A Mutual Loop Inductance in Fully Interdigitated Power Distribution Grids with DSDG 495
B Mutual Loop Inductance in Pseudo- Interdigitated Power Distribution Grids with DSDG 497
C Mutual Loop Inductance in Fully Paired Power Distribution Grids with DSDG 499
D Mutual Loop Inductance in Pseudo-Paired Power Distribution Grids with DSDG 501
References 503
Index 526
About the Authors 530

Produkt-Details

• Erscheint lt. Verlag: 8.10.2007
• Zusatzinfo: XXXII, 516 p.
• Verlagsort: New York
• Sprache: englisch
• Themenwelt: Informatik ► Weitere Themen ► CAD-Programme
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Schlagworte: algorithms • Capacitors • Computer-Aided Design (CAD) • Friedman • Integrated circuit • Mezhiba • Networks • On-Chip Decoupling • Popovich • Power distribution
• ISBN-10: 0-387-71601-7 / 0387716017
• ISBN-13: 978-0-387-71601-5 / 9780387716015