Interconnect Analysis and Synthesis
Seiten
1999
Wiley-Interscience (Verlag)
978-0-471-29366-8 (ISBN)
Wiley-Interscience (Verlag)
978-0-471-29366-8 (ISBN)
Bottlenecks in signal distribution systems are becoming more serious and set a limit on achievable speeds. This book examines methods to optimize performance, featuring a detailed discussion of a "taxonomy of problem formulation".
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features:
Models for interconnect as well as devices and the impact of scaling trends
Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis
An overview of the effects of inductance on on-chip interconnect
Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology
Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
State-of-the-art methods and current perspectives on interconnect The irrepressible march toward smaller and faster integrated circuits has made interconnect a hot topic for semiconductor research. The effects of wire size, topology construction, and network design on system performance and reliability have all been thoroughly investigated in recent years. Interconnect Analysis and Synthesis provides CAD researchers and engineers with powerful, state-of-the-art tools for the analysis, design, and optimization of interconnect. It brings together a wealth of information previously scattered throughout the literature, explaining in depth available analysis techniques and presenting a range of CAD algorithms for synthesizing and optimizing interconnect. Along with examples and results from the semiconductor industry and 150 illustrations, this practical work features:
Models for interconnect as well as devices and the impact of scaling trends
Modern analysis techniques, from matrix reduction and moment matching to transmission-line analysis
An overview of the effects of inductance on on-chip interconnect
Flexible CAD algorithms that can be generalized for different needs, from buffer insertion to wire sizing to routing topology
Emphasis on realistic problem formulations, addressing key design tradeoffs such as those between area and performance
Chung-Kuan Cheng is the author of Interconnect Analysis and Synthesis, published by Wiley. John Lillis is the author of Interconnect Analysis and Synthesis, published by Wiley. Shen Lin is the author of Interconnect Analysis and Synthesis, published by Wiley. Norman Chang is the author of Interconnect Analysis and Synthesis, published by Wiley.
Interconnect Models.
Device Models.
Interconnect Analysis.
Inductance and Inductive Coupling for On-chip Interconnect.
Synthesis: Overview and Static Topology Optimization.
Global Routing Topology Synthesis.
Optimization of Multi-Source Nets.
Timing Driven Maze Routing.
| Erscheint lt. Verlag | 30.11.1999 |
|---|---|
| Sprache | englisch |
| Maße | 161 x 246 mm |
| Gewicht | 522 g |
| Themenwelt | Informatik ► Weitere Themen ► Hardware |
| Technik ► Elektrotechnik / Energietechnik | |
| Technik ► Nachrichtentechnik | |
| ISBN-10 | 0-471-29366-0 / 0471293660 |
| ISBN-13 | 978-0-471-29366-8 / 9780471293668 |
| Zustand | Neuware |
| Haben Sie eine Frage zum Produkt? |
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