Nicht aus der Schweiz? Besuchen Sie lehmanns.de

Quantifying and Exploring the Gap Between FPGAs and ASICs

, (Autoren)

Buch | Hardcover
180 Seiten
2009
Springer-Verlag New York Inc.
978-1-4419-0738-7 (ISBN)

Lese- und Medienproben

Quantifying and Exploring the Gap Between FPGAs and ASICs - Ian Kuon, Jonathan Rose
CHF 194,70 inkl. MwSt
  • Versand in 10-15 Tagen
  • Versandkostenfrei
  • Auch auf Rechnung
  • Artikel merken
Field-programmable gate arrays (FPGAs), which are pre-fabricated, programmable digital integrated circuits (ICs), provide easy access to state-of-the-art integrated circuit process technology, and in doing so, democratize this technology of our time. This book is about comparing the qualities of FPGA – their speed performance, area and power consumption, against custom-fabricated ICs, and exploring ways of mitigating their de ciencies. This work began as a question that many have asked, and few had the resources to answer – how much worse is an FPGA compared to a custom-designed chip? As we dealt with that question, we found that it was far more dif cult to answer than we anticipated, but that the results were rich basic insights on fundamental understandings of FPGA architecture. It also encouraged us to nd ways to leverage those insights to seek ways to make FPGA technology better, which is what the second half of the book is about. While the question “How much worse is an FPGA than an ASIC?” has been a constant sub-theme of all research on FPGAs, it was posed most directly, some time around May 2004, by Professor Abbas El Gamal from Stanford University to us – he was working on a 3D FPGA, and was wondering if any real measurements had been made in this kind of comparison. Shortly thereafter we took it up and tried to answer in a serious way.

Background.- Measuring the Gap.- Automated Transistor Sizing for FPGAs.- Navigating the Gap Using Architecture and Process Technology Scaling.- Navigating the Gap using Transistor Sizing.- Conclusions and FutureWork.

Zusatzinfo XI, 180 p.
Verlagsort New York, NY
Sprache englisch
Maße 155 x 235 mm
Themenwelt Informatik Weitere Themen CAD-Programme
Informatik Weitere Themen Hardware
Technik Elektrotechnik / Energietechnik
ISBN-10 1-4419-0738-6 / 1441907386
ISBN-13 978-1-4419-0738-7 / 9781441907387
Zustand Neuware
Haben Sie eine Frage zum Produkt?
Mehr entdecken
aus dem Bereich
Band 1: Produktion

von Thomas Bauernhansl

Buch | Hardcover (2024)
Springer Vieweg (Verlag)
CHF 139,95
Einführung in die Geometrische Produktspezifikation

von Daniel Brabec; Ludwig Reißler; Andreas Stenzel

Buch | Softcover (2023)
Europa-Lehrmittel (Verlag)
CHF 27,90