Soldering in Electronics Assembly (eBook)

Keith Brindley, MIKE JUDD (Autoren)

eBook Download: PDF

1999 | 2. Auflage
369 Seiten
Elsevier Science (Verlag)
978-0-08-051734-6 (ISBN)

Infos

Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly.



Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type, solder, flux, and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action, purpose of flux and relevant flux types for any application, classification of assembly variants, assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology.

Mike Judd is MD of Mike Judd Marketing and former MD of Electrovert UK, Director of Marketing Europe for Electrovert, part of the Cookson Group, and Director of OEM at Speedline.

Keith Brindley is a technical author with a wealth of experience of all aspects of electronics technology.

- A practical guide for the industry covering all the main soldering processes currently in use
- Cleaning, faults, troubleshooting and standards are all major topics
- Considers safety and solder process quality assessment

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Managers, engineers and technicians will use this book during industrial construction of electronics assemblies, whilst students can use the book to get a grasp of the variety of methods available, together with a discussion of technical concerns. It includes over 200 illustrations, including a photographic guide to defects, and contains many line drawings, tables and flow charts to illustrate the subject of electronics assembly. Soldering in Electronics Assembly looks theoretically at everything needed in a detailed study, but in a practical manner. It examines the soldering processes in the light of electronic assembly type; solder; flux; and cleaning requirements. It has information on every available process, from the most basic hand soldering through to latest innovatory ones such as inert atmosphere wave soldering and zoned forced convection infra-red machines. The book provides a detailed analysis of solder and soldering action; purpose of flux and relevant flux types for any application; classification of assembly variants; assessment and maintenance of solderability. There is also a detailed analysis of soldering process defects and causes. In addition, Soldering in Electronics Assembly contains a new chapter on Ball Grid Array (BGA) technology. - A practical guide for the industry covering all the main soldering processes currently in use- Cleaning, faults, troubleshooting and standards are all major topics- Considers safety and solder process quality assessment

Inhalt

Cover 
1 
Contents 6
Foreword 8
Preface 10
Acknowledgements 14
Chapter 1. Soldering process 16
Time on its side 17
Printed circuit board 20
Soldering 23
Soldering processes 31
Component/solder (CS) processes 33
Solder/component (SC) processes 34
Cleaning 36
Quality 36
Safety 37
Chapter 2. Electronics assemblies 38
Joints 38
Through-hole joints 42
Surface mounted components 50
Surface mounted joints 51
Assembly variations 58
Assembly classification 64
Chapter 3. Solder 66
Metallurgical properties of tin/lead alloys 66
The soldered joint 71
Solderability 81
Protective coatings 87
Chapter 4. Lead-free solder 96
What's needed in the future? 96
Lead-free soldering „ now a hot topic! 98
The age of lead-free soldering is approaching fast 102
ITRI 103
Chapter 5. Flux 104
Need for flux 105
How fluxes work 106
Categorization of fluxes 107
Choosing a flux 113
Application of fluxes 114
SC soldering process flux 122
Chapter 6. Solder paste 124
Solder paste or adhesive application 124
Dispensing 133
Pin transfer 137
Using solder paste 138
Solder paste parameters 139
Chapter 7. CS soldering processes 142
Hand soldering 142
Mass CS soldering processes 149
Inert atmosphere soldering 151
Handling assemblies 151
Solder pots and pumps 161
Solder pot heaters 162
Soldering 163
Soldering process monitoring 178
Chapter 8. SC soldering processes 180
Heat application 180
Infra-red soldering 182
Hot air convection 188
Hot vapour soldering 189
Laser soldering 193
Light beam soldering 197
Heated collet or hot bar 197
Miscellaneous SC soldering processes 200
Comparison of soldering processes 201
Chapter 9. Profiling soldering processes 202
Profiles 202
Infra-red soldering temperature profiles 207
Hot vapour soldering temperature profiles 208
Heated collet temperature profiles 209
Optimizing temperature profiles 210
Chapter 10. Cleaning soldered assemblies 214
The Montreal Protocol 214
Why clean at all? 215
Contamination 217
Classifications of cleaner 219
Cleaning processes 223
Contamination testing 233
Comparing the cleaning options 236
Chapter 11. Avoiding problems „ soldering quality 238
Have problems occurred? 239
Statistical process control 239
Solutions to problems 242
Criteria for the assessment of soldered joints 243
Characteristics of soldered joints 244
Classification of soldered joints 245
Features of solder joints on surface mounted boards 245
X-ray inspection 247
Visual inspection standards 250
Photographic guide to defects 251
Chapter 12. Standards & specifications
Why comply with standards 290
Reference to standards 291
Levels of standards 291
Standards organizations and bodies 292
Standards for electronics assembly manufacture 295
Guide to relevant worldwide standards 298
Glossary 314
References 326
Further reading 328
Worldwide addresses 338
Appendix 1. Why not blame the machine? 348
Appendix 2. Problems & solutions
Appendix 3. Soldering safety 358
Appendix 4. Comparing soldering processes & machines
Index 381

Produkt-Details

• Erscheint lt. Verlag: 26.3.1999
• Sprache: englisch
• Themenwelt: Kunst / Musik / Theater ► Design / Innenarchitektur / Mode
• Themenwelt: Technik ► Elektrotechnik / Energietechnik
• Themenwelt: Technik ► Maschinenbau
• ISBN-10: 0-08-051734-X / 008051734X
• ISBN-13: 978-0-08-051734-6 / 9780080517346