Three-Dimensional Integration and Modeling

A Revolution in RF and Wireless Packaging

Jong-Hoon Lee, Manos M. Tentzeris (Autoren)

Buch | Softcover

108 Seiten

2007
Morgan & Claypool Publishers (Verlag)
978-1-59829-244-2 (ISBN)

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Presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks, as well as a multilayer ceramic V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.

This book presents a step-by-step discussion of the 3D integration approach for the development of compact system-on-package (SOP) front-ends.Various examples of fully-integrated passive building blocks (cavity/microstip filters, duplexers, antennas), as well as a multilayer ceramic (LTCC) V-band transceiver front-end midule demonstrate the revolutionary effects of this approach in RF/Wireless packaging and multifunctional miniaturization.

Designs covered are based on novel ideas and are presented for the first time for millimeterwave (60GHz) ultrabroadband wireless modules.

Introduction
Background on Technologies for Millimeter-Wave Passive Front-Ends
Three-Dimensional Packaging in Multilayer Organic Substrates
Microstrip-Type Integrated Passives
Cavity-Type Integrated Passives
Three-Dimensional Antenna Architectures
Fully Integrated Three-Dimensional Passive Front-Ends
References

Reihe/Serie	Synthesis Lectures on Computational Electromagnetics
Verlagsort	San Rafael
Sprache	englisch
Maße	187 x 235 mm
Themenwelt	Technik ► Elektrotechnik / Energietechnik
ISBN-10	1-59829-244-7 / 1598292447
ISBN-13	978-1-59829-244-2 / 9781598292442
Zustand	Neuware