Fundamentals of Electrochemical Deposition
Seiten
1998
John Wiley & Sons Inc (Verlag)
978-0-471-16820-1 (ISBN)
John Wiley & Sons Inc (Verlag)
978-0-471-16820-1 (ISBN)
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It would be difficult to overstate the importance of electrochemical deposition to science and technology in the late twentieth century. This book covers the fundamentals.
It would be difficult to overstate the importance of electrochemical deposition to science and technology in the late twentieth century. If not for modern electrochemical deposition methods developed over the past decade and a half, many of today's technological wonders simply would never have been. From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition now plays a crucial role in an array of key industries. And, if the recent shift from physical to electrochemical techniques in microcircuit manufacturing is any indication, its importance will only continue to grow in the years ahead. This book offers a wide-ranging, authoritative look at state-of-the-art electrochemical deposition theory and practice. Written by an author team with extensive experience in both industry and academe, it provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology. Over the course of 18 independent chapters, Drs.
Paunovic and Schlesinger present detailed coverage of the full range of electrochemical deposition processes and technologies, including: Metal-solution interphase Charge transfer across an interphase Formation of an equilibrium electrode potential Nucleation and growth of thin films Kinetics and mechanisms of electrodeposition Electroless deposition In situ characterization of deposition processes Structure and properties of deposits Multilayered and composite thin films Interdiffusion in thin film. Fundamentals of Electrochemical Deposition is an ideal graduate-level textbook for students of electrochemistry and related areas. It is also an indispensable working resource for all professionals who use this technology, including platers and metal finishers. Fundamentals of Electrochemical Deposition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. With the help of examples drawn from a wide range of areas, the authors describe the science and technology behind all electrodeposition methods currently used in industry.
Emphasizing the practical concerns of professionals who use this technology, they provide detailed coverage of: nIonic solutions, metal surfaces, and metal-solution interphases Electrode potential, deposition kinetics, and thin film nucleation Electroless and displacement type depositions Effects of additives and the science and technology of alloy deposition Current distribution during deposition In situ and ex situ deposit characterization Mathematical modeling in electrochemistry Structure, properties of deposits, multilayers, and interdiffusion.
It would be difficult to overstate the importance of electrochemical deposition to science and technology in the late twentieth century. If not for modern electrochemical deposition methods developed over the past decade and a half, many of today's technological wonders simply would never have been. From computer hardware to automobiles, medical diagnostics to aerospace, electrochemical deposition now plays a crucial role in an array of key industries. And, if the recent shift from physical to electrochemical techniques in microcircuit manufacturing is any indication, its importance will only continue to grow in the years ahead. This book offers a wide-ranging, authoritative look at state-of-the-art electrochemical deposition theory and practice. Written by an author team with extensive experience in both industry and academe, it provides a well-rounded introduction to the field for students, as well as a means for professional chemists, engineers, and technicians to expand and sharpen their skills in using the technology. Over the course of 18 independent chapters, Drs.
Paunovic and Schlesinger present detailed coverage of the full range of electrochemical deposition processes and technologies, including: Metal-solution interphase Charge transfer across an interphase Formation of an equilibrium electrode potential Nucleation and growth of thin films Kinetics and mechanisms of electrodeposition Electroless deposition In situ characterization of deposition processes Structure and properties of deposits Multilayered and composite thin films Interdiffusion in thin film. Fundamentals of Electrochemical Deposition is an ideal graduate-level textbook for students of electrochemistry and related areas. It is also an indispensable working resource for all professionals who use this technology, including platers and metal finishers. Fundamentals of Electrochemical Deposition is a comprehensive introduction to one of today's most exciting and rapidly evolving fields of practical knowledge. With the help of examples drawn from a wide range of areas, the authors describe the science and technology behind all electrodeposition methods currently used in industry.
Emphasizing the practical concerns of professionals who use this technology, they provide detailed coverage of: nIonic solutions, metal surfaces, and metal-solution interphases Electrode potential, deposition kinetics, and thin film nucleation Electroless and displacement type depositions Effects of additives and the science and technology of alloy deposition Current distribution during deposition In situ and ex situ deposit characterization Mathematical modeling in electrochemistry Structure, properties of deposits, multilayers, and interdiffusion.
MILAN PAUNOVIC, PhD, is a researcher with IBM's T. J. Watson Research Center in Yorktown Heights, New York. MORDECHAY SCHLESINGER, PhD, is a professor in the Department of Physics, University of Windsor, Ontario, Canada.
An Overview.; Water and Ionic Solutions.; Metals and Metal Surfaces.; Metal--Solution Interphase.; Equilibrium Electrode Potential.; Kinetics and Mechanism of Electrodeposition.; Nucleation and Growth Models.; Electroless Deposition.; Displacement Deposition.; Effect of Additives.; Electrodeposition of Alloys.; Metal Deposit and Current Distribution.; Characterization of Metallic Surfaces and Thin Films.; In Situ Characterization of Deposition.; Mathematical Modeling in Electrochemistry.; Structure and Properties of Deposits.; Electrodeposited Multilayers.; Interdiffusion in Thin Films.; Index.
| Erscheint lt. Verlag | 10.11.1998 |
|---|---|
| Zusatzinfo | Illustrations |
| Verlagsort | New York |
| Sprache | englisch |
| Maße | 164 x 242 mm |
| Gewicht | 539 g |
| Einbandart | gebunden |
| Themenwelt | Naturwissenschaften ► Chemie ► Physikalische Chemie |
| Naturwissenschaften ► Chemie ► Technische Chemie | |
| Technik | |
| ISBN-10 | 0-471-16820-3 / 0471168203 |
| ISBN-13 | 978-0-471-16820-1 / 9780471168201 |
| Zustand | Neuware |
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